SLUU231A June   2006  – January 2022 TPS40074

 

  1.   Trademarks
  2. 1Introduction
    1. 1.1 Description
    2. 1.2 Applications
    3. 1.3 Features
  3. 2TPS40074EVM-001 Electrical Performance Specifications
  4. 3Schematic
    1. 3.1 Adjusting Output Voltage (R5 and R6)
    2. 3.2 Using Remote Sense (J3)
    3. 3.3 5V Input Operation (R10 and R15)
  5. 4Test Setup
    1. 4.1 Equipment
      1. 4.1.1 Voltage Source
      2. 4.1.2 Meters
      3. 4.1.3 Loads
      4. 4.1.4 Recommended Wire Gauge
      5. 4.1.5 Other
    2. 4.2 Equipment Setup
      1. 4.2.1 Procedure
      2. 4.2.2 Diagram
    3. 4.3 Start-Up/Shutdown Procedure
    4. 4.4 Equipment Shutdown
  6. 5TPS40074EVM Typical Performance Data and Characteristic Curves
    1. 5.1 Efficiency
    2. 5.2 Line and Load Regulation
  7. 6EVM Assembly Drawings and Layout
  8. 7List of Materials
  9. 8Revision History

6 EVM Assembly Drawings and Layout

Figure 6-1 through Figure 6-6 show the design of the TPS40074EVM-001 printed circuit board. The EVM has been designed using a 4-layer, 2-oz copper-clad circuit board 3.0 inch × 3.0 inch with all components on the top side to allow the user to easily view, probe, and evaluate the TPS40074 control IC in a practical application. Moving components to both sides of the PCB or using additional internal layers can offer additional size reduction for space constrained systems.

GUID-63F1A59D-49F3-491F-9C1B-05D2197C6160-low.gifFigure 6-1 TPS40074EVM-001 Component Placement (Viewed from Top)
GUID-436B4387-1AE8-47C4-A357-70D625E959FC-low.gifFigure 6-2 TPS40074EVM-001 Silkscreen (Viewed from Top)
GUID-50DD9C68-9B3D-4A19-A560-AD7B73530622-low.gifFigure 6-3 TPS40074EVM-001 Top Copper (Viewed from Top)
GUID-7C4B2F9F-10F2-4AFB-9FEE-F5540EF79E34-low.gifFigure 6-4 TPS40074EVM-001 Layer 2 (X-Ray View from Top)
GUID-1A2E45DC-5521-41BF-BDF0-A70D9469A09E-low.gifFigure 6-5 TPS40074EVM-001 Layer 3 (X-Ray View from Top)
GUID-D268D8FF-25E9-49B6-A190-CE73437F1D9C-low.gifFigure 6-6 TPS40074EVM-001 Bottom Copper (X-Ray View from Top)