SLUUCU2A March   2023  – September 2023 UCC14130-Q1 , UCC14131-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1. 1.1 U1 Component Selection
    2. 1.2 Pin Configuration and Functions
  5. 2Description
    1. 2.1 EVM Electrical Performance Specifications
  6. 3Schematic
  7. 4EVM Setup and Operation
    1. 4.1 Recommended Test Equipment
    2. 4.2 External Connections for Easy Evaluation
    3. 4.3 Powering the EVM
      1. 4.3.1 Power on for Start-up
      2. 4.3.2 Power off for Shutdown
    4. 4.4 EVM Test Points
    5. 4.5 Probing the EVM
  8. 5Performance Data
    1. 5.1  Efficiency Data
    2. 5.2  Regulation Data
    3. 5.3  Steady State Input Current
    4. 5.4  Start-Up Waveforms
    5. 5.5  Inrush Current
    6. 5.6  AC Ripple Voltage
    7. 5.7  EN and Timing
    8. 5.8  RLIM
    9. 5.9  Shutdown
    10. 5.10 Thermal Performance
  9. 6Assembly and Printed Circuit Board (PCB) Layers
  10. 7Bill of Materials (BOM)
  11. 8Revision History

Assembly and Printed Circuit Board (PCB) Layers

The UCC14131EVM-070 is designed using a four-layer, FR4, PCB, fabricated with 2-ounce copper on all four layers. The EVM, PCB demonstrates the important use of ground planes and tented stitching vias for shielding and improving EMI performance. For higher density PCBs such as automotive traction inverters, the PCB can include several additional signal layers but similar design methodology can be applied as best as possible.

GUID-512D5CFB-16A6-47B6-B697-0EBCE85CB01F-low.png Figure 6-1 UCC14131EVM-070, Fully Assembled 3D Top View
GUID-F08EFB0B-23F1-406A-B582-CC385A37886B-low.png Figure 6-2 UCC14131EVM-070, Fully Assembled 3D Bottom View
GUID-7444E169-B8DF-4290-818E-9ED997DD9D90-low.png Figure 6-3 UCC14131EVM-070, 3D Angle View
GUID-13AC449C-D1D2-4117-AA82-16AE50C1776F-low.png Figure 6-4 UCC14131EVM-070, PCB Top Layer, Assembly
GUID-30015CB0-1C8D-4ED4-AD6D-09679273A2B5-low.png Figure 6-5 UCC14131EVM-070, GND Layer 2 (same as layer 3)
GUID-815EEBDC-4709-423C-B723-B7A116578BEF-low.png Figure 6-6 UCC14131EVM-070, GND Layer 3 (same as layer 2)
GUID-7A7933C9-71CC-4241-9A8B-0494E7F9C2BC-low.png Figure 6-7 UCC14131EVM-070, PCB Bottom Layer, Assembly (mirrored view)