SLVK166 January   2024 TMS570LC4357-SEP

PRODUCTION DATA  

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Texas Instruments Enhanced Product Qualification and Reliability Report
  5. 2Space Enhanced Production Flow
    1. 2.1 Device Introduction
    2. 2.2 TMS570LC4357-SEP Production Flow
  6. 3Device Qualification
    1.     9
    2. 3.1 Space Enhanced Products New Device Qualification Matrix
  7. 4Outgas Test Report

Space Enhanced Products New Device Qualification Matrix

*Note that qualification by similarity (“qualification family”) per JEDEC JESD47 is allowed.

Description Condition Sample Size
(Used or Rejects)
Lots Required Test Method
Sample Device TMS5704357BGWTSEP
Electromigration Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Wire Bond Life Maximum Recommended Operating Conditions N/A N/A Per TI Design Rules
Electrical Characterization TI Data Sheet 10 3 N/A
Electrostatic Discharge Sensitivity HBM per TI Data Sheet 3 units/voltage 1 JEDEC JS-001 or EIA/JESD22-A114
CDM per TI Data sheet JEDEC JS-002 or EIA/JESD22-C101
Latch-up Per Technology 6/0 1 EIA/JESD78
Physical Dimensions TI Data Sheet 5/0 1 EIA/JESD22-B100
Thermal Impedance Theta-JA on board Per Pin-Package N/A EIA/JESD51
Bias Life Test 125°C / 1000 hours or equivalent 77/0 3 JESD22-A108*
Biased HAST 130°C / 85% / 96 hours or
110°C / 85% / 264 hours or
85°C / 85% / 1000 hours
77/0 3 JESD22-A110/A101*
Extended Biased HAST 130°C / 85% / 250 hours or
110°C / 85% / 687 hours or
85°C / 85% / 2600 hours
77/0 1 JESD22-A110/A101*
Unbiased HAST 130°C / 85% / 96 hours or equivalent 77/0 3 JESD22-A118*
Temperature Cycle -65°C to +150°C non-biased 500 cycles or equivalent 77/0 3 JESD22-A104*
Solder Heat 260°C for 10 seconds 22/0 1 JESD22-B106
Resistance to Solvents Ink symbol only 12/0 1 JESD22-B107
Solderability J-STD-002 22/0 1 ANSI/J-STD-002-92
Flammability Method A / Method B 5/0 1 UL-1964
Bond Shear Per wire size 5 units × 30/0 bonds 3 JESD22-B116
Bond Pull Strength Per wire size 5 units × 30/0 bonds 3 ASTM F-459
Die Shear Per die size 5/0 3 MIL-STD-883, TM 2019
High Temperature Storage 150°C / 1000 hours 15/0 3 JESD22-A103*
Moisture Sensitivity Surface Mount Only 12 1 J-STD-020*
Radiation Response Characterization TI Data Sheet 5 units/dose level 1 MIL-STD-883/Method 1019
Outgassing Characterization TML <=1% (Total Mass Lost)
CVCM <=0.1% (Collected Volatile Condensable Material)
5 1 ASTM E595