SLVSEO1A August   2021  – May 2022 ADC08DJ5200RF

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC Specifications
    6. 6.6  Electrical Characteristics: Power Consumption
    7. 6.7  Electrical Characteristics: AC Specifications (Dual-Channel Mode)
    8. 6.8  Electrical Characteristics: AC Specifications (Single-Channel Mode)
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Comparison
      2. 7.3.2 Analog Inputs
        1. 7.3.2.1 Analog Input Protection
        2. 7.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 7.3.2.3 Analog Input Offset Adjust
      3. 7.3.3 ADC Core
        1. 7.3.3.1 ADC Theory of Operation
        2. 7.3.3.2 ADC Core Calibration
        3. 7.3.3.3 Analog Reference Voltage
        4. 7.3.3.4 ADC Overrange Detection
        5. 7.3.3.5 Code Error Rate (CER)
      4. 7.3.4 Temperature Monitoring Diode
      5. 7.3.5 Timestamp
      6. 7.3.6 Clocking
        1. 7.3.6.1 Noiseless Aperture Delay Adjustment (tAD Adjust)
        2. 7.3.6.2 Aperture Delay Ramp Control (TAD_RAMP)
        3. 7.3.6.3 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          1. 7.3.6.3.1 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
          2. 7.3.6.3.2 Automatic SYSREF Calibration
      7. 7.3.7 Programmable FIR Filter (PFIR)
        1. 7.3.7.1 Dual Channel Equalization
        2. 7.3.7.2 Single Channel Equalization
        3. 7.3.7.3 Time Varying Filter
      8. 7.3.8 JESD204C Interface
        1. 7.3.8.1 Transport Layer
        2. 7.3.8.2 Scrambler
        3. 7.3.8.3 Link Layer
        4. 7.3.8.4 8B/10B Link Layer
          1. 7.3.8.4.1 Data Encoding (8B/10B)
          2. 7.3.8.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 7.3.8.4.3 Code Group Synchronization (CGS)
          4. 7.3.8.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 7.3.8.4.5 Frame and Multiframe Monitoring
        5. 7.3.8.5 64B/66B Link Layer
          1. 7.3.8.5.1 64B/66B Encoding
          2. 7.3.8.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
          3. 7.3.8.5.3 Block, Multiblock and Extended Multiblock Alignment using Sync Header
            1. 7.3.8.5.3.1 Cyclic Redundancy Check (CRC) Mode
            2. 7.3.8.5.3.2 Forward Error Correction (FEC) Mode
          4. 7.3.8.5.4 Initial Lane Alignment
          5. 7.3.8.5.5 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 7.3.8.6 Physical Layer
          1. 7.3.8.6.1 SerDes Pre-Emphasis
        7. 7.3.8.7 JESD204C Enable
        8. 7.3.8.8 Multi-Device Synchronization and Deterministic Latency
        9. 7.3.8.9 Operation in Subclass 0 Systems
      9. 7.3.9 Alarm Monitoring
        1. 7.3.9.1 Clock Upset Detection
        2. 7.3.9.2 FIFO Upset Detection
    4. 7.4 Device Functional Modes
      1. 7.4.1 Dual-Channel Mode
      2. 7.4.2 Single-Channel Mode (DES Mode)
      3. 7.4.3 Dual-Input Single-Channel Mode (DUAL DES Mode)
      4. 7.4.4 JESD204C Modes
        1. 7.4.4.1 JESD204C Operating Modes Table
        2. 7.4.4.2 JESD204C Modes continued
        3. 7.4.4.3 JESD204C Transport Layer Data Formats
        4. 7.4.4.4 64B/66B Sync Header Stream Configuration
      5. 7.4.5 Power-Down Modes
      6. 7.4.6 Test Modes
        1. 7.4.6.1 Serializer Test-Mode Details
        2. 7.4.6.2 PRBS Test Modes
        3. 7.4.6.3 Clock Pattern Mode
        4. 7.4.6.4 Ramp Test Mode
        5. 7.4.6.5 Short and Long Transport Test Mode
          1. 7.4.6.5.1 Short Transport Test Pattern
        6. 7.4.6.6 D21.5 Test Mode
        7. 7.4.6.7 K28.5 Test Mode
        8. 7.4.6.8 Repeated ILA Test Mode
        9. 7.4.6.9 Modified RPAT Test Mode
      7. 7.4.7 Calibration Modes and Trimming
        1. 7.4.7.1 Foreground Calibration Mode
        2. 7.4.7.2 Background Calibration Mode
        3. 7.4.7.3 Low-Power Background Calibration (LPBG) Mode
      8. 7.4.8 Offset Calibration
      9. 7.4.9 Trimming
    5. 7.5 Programming
      1. 7.5.1 Using the Serial Interface
        1. 7.5.1.1 SCS
        2. 7.5.1.2 SCLK
        3. 7.5.1.3 SDI
        4. 7.5.1.4 SDO
        5. 7.5.1.5 Streaming Mode
    6. 7.6 SPI Register Map
  8. Application Information Disclaimer
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Reconfigurable Dual-Channel 5-GSPS or Single-Channel 10-Gsps Oscilloscope
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
          3. 8.2.1.1.3 ADC08DJ5200RF
    3. 8.3 Initialization Set Up
  9. Power Supply Recommendations
    1. 9.1 Power Sequencing
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 123
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Clocking

The clocking subsystem of the device has two input signals, device clock (CLK+, CLK–) and SYSREF (SYSREF+, SYSREF–). Within the clocking subsystem there is a noiseless aperture delay adjustment (tAD adjust), a clock duty cycle corrector and a SYSREF capture block. Figure 7-2 describes the clocking subsystem.

GUID-4549A08A-E9EA-444E-A527-AFE80905FA37-low.gifFigure 7-2 Clocking Subsystem

The device clock is used as the sampling clock for the ADC core as well as the clocking for the digital processing and serializer outputs. Use a low-noise (low jitter) device clock to maintain high signal-to-noise ratio (SNR) within the ADC. In dual-channel mode, the analog input signal for each input is sampled on the rising edge of the device clock. In single-channel mode, both the rising and falling edges of the device clock are used to capture the analog signal to reduce the maximum clock rate required by the ADC. A noiseless aperture delay adjustment (tAD adjust) allows the user to shift the sampling instance of the ADC in fine steps in order to synchronize multiple ADC08DJ5200RFs or to fine-tune system latency. Duty cycle correction is implemented in the device to ease the requirements on the external device clock while maintaining high performance. Table 7-4 summarizes the device clock interface in dual-channel mode and single-channel mode.

Table 7-4 Device Clock vs Mode of Operation
MODE OF OPERATIONSAMPLING RATE VS fCLKSAMPLING INSTANT
Dual-channel mode1 × fCLKRising edge
Single-channel mode2 × fCLKRising and falling edge

SYSREF is a system timing reference used for JESD204C subclass-1 implementations of deterministic latency. SYSREF is used to achieve deterministic latency and for multi-device synchronization. SYSREF must be captured by the correct device clock edge in order to achieve repeatable latency and synchronization. The ADC08DJ5200RF includes SYSREF windowing and automatic SYSREF calibration to ease the requirements on the external clocking circuits and to simplify the synchronization process. SYSREF can be implemented as a single pulse or as a periodic clock. In periodic implementations, SYSREF must be equal to, or an integer division of, the local multiframe clock frequency in 8B/10B encoding modes or the local extended multiblock clock frequency in 64B/66B encoding modes. Equation 2 is used to calculate valid SYSREF frequencies in 8B/10B encoding modes and Equation 3 in 64B/66B encoding modes.

Equation 2. GUID-44B16E7C-88FA-4039-998C-233467BEFC79-low.gif
Equation 3. GUID-20201106-CA0I-Q8FT-LXBQ-XZLMSKPBF3JL-low.gif

where

  • R and F are set by the JMODE setting (see )
  • fCLK is the device clock frequency (CLK±)
  • K is the programmed multiframe length (see for valid K settings)
  • E is the number of multiblocks in an extended multiblock.
  • n is any positive integer