SLVUCS3 October   2023

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 Jumper Information
    2. 2.2 Test Points
  8. 3Hardware Design Files
    1. 3.1 Schematics
    2. 3.2 PCB Layouts
    3. 3.3 Bill of Materials (BOM)
  9. 4Additional Information
    1. 4.1 Trademarks

PCB Layouts

GUID-20231013-SS0I-6DGP-DGTB-KMBPFCVGLVGK-low.svg Figure 3-2 3D Representation
GUID-20231013-SS0I-PRM7-GPQS-NNQFZPHHT9P2-low.svg Figure 3-3 Top Layer
GUID-20231013-SS0I-TJNS-R26X-JKHC4BR9TRNR-low.svg Figure 3-4 Ground Layer
GUID-20231013-SS0I-LV0T-RZL8-GZCPVJHBL4HD-low.svg Figure 3-5 Power Layer
GUID-20231013-SS0I-KWNP-S78V-GLVD6PSJMMCR-low.svg Figure 3-6 Bottom Layer