SLVUCT1 April   2024 TPSM64406

 

  1.   1
  2.   Description
  3.   Features
  4.   Applications
  5.   5
  6. 1Evaluation Module Overview
    1. 1.1 Introduction
    2. 1.2 Kit Contents
    3. 1.3 Specification
    4. 1.4 Device Information
  7. 2Hardware
    1. 2.1 EVM Connections
    2. 2.2 EVM Setup
      1. 2.2.1 Input Connections
      2. 2.2.2 Output Connections
  8. 3Implementation Results
    1. 3.1 Test Equipment
    2. 3.2 Test Data and Performance Curves
      1. 3.2.1 Efficiency and Load Regulation Performance
      2. 3.2.2 Waveforms and Plots
      3. 3.2.3 EMI Performance
      4. 3.2.4 Thermal Performance
  9. 4Hardware Design Files
    1. 4.1 Schematics
    2. 4.2 PCB Layouts
    3. 4.3 Bill of Materials (BOM)
  10. 5Additional Information
    1. 5.1 Trademarks
  11. 6Related Documentation
    1. 6.1 Supplemental Content
    2. 6.2 Custom Design With WEBENCH Tools

PCB Layouts

The PCB is 62-mils standard thickness with 2-oz copper on all 6 layers.

GUID-20231215-SS0I-R9LD-NZGD-SD97MSPPTC1J-low.svg Figure 4-2 Top 3D View
GUID-20231215-SS0I-6RLJ-3BP1-1WTSPGLPWJ9M-low.svg Figure 4-3 Bottom 3D View
GUID-20240307-SS0I-96ZQ-0FGT-D3Z5ZWX7NJTL-low.svg Figure 4-4 Top Layer Copper
GUID-20240307-SS0I-RF8G-GH27-T46FG6S8ZMQB-low.svg Figure 4-5 Layer 2 Copper
GUID-20240307-SS0I-DD3C-LVKP-5DFSLQVTSPQM-low.svg Figure 4-6 Layer 3 Copper
GUID-20240307-SS0I-WZTN-VZQW-X2LTRS0GF6CV-low.svg Figure 4-7 Layer 4 Copper
GUID-20240307-SS0I-6N8B-BGPH-RW8PV7ZWBM9K-low.svg Figure 4-8 Layer 5 Copper
GUID-20240307-SS0I-DNQ8-S2T2-R38WBFQLPCZ9-low.svg Figure 4-9 Layer 6 Copper
GUID-20240314-SS0I-23JC-ZZ1J-3RHPSGW0TZTL-low.svg Figure 4-10 Layer Thickness