SNOSD74B May   2019  – January 2020 LMG1025-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Typical (Simplified) System Diagram
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Stage
      2. 7.3.2 Output Stage
      3. 7.3.3 Bias Supply and Under Voltage Lockout
      4. 7.3.4 Overtemperature Protection (OTP)
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Handling Ground Bounce
        2. 8.2.2.2 Creating Nanosecond Pulse
      3. 8.2.3 VDD and Overshoot
      4. 8.2.4 Operating at Higher Frequency
      5. 8.2.5 Application Curves
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Gate Drive Loop Inductance and Ground Connection
      2. 10.1.2 Bypass Capacitor
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

VDD and Overshoot

Fast switching with high current is prone to ringing with parasitic inductances, including those on PCB traces. Overshoot associated with such ringing transients need to be evaluated and controlled as a part of the PCB design process to limit device stress. The parameters affecting stress are how high the overshoot is above the absolute maximum specification and the ratio of overshoot duration to the switching time period. Recommended design practice is to limit the overshoots to the absolute maximum pin voltages. This is accomplished with carful PCB layout to minimize parasitic inductances, choice of components with low ESL and addition of series resistance to limit rise times. For large overshoots, limiting the variability of the power supply may be required. For example, 0.5V of overshoot will be permissible with a maximum recommended supply of 5.25 V (5% variability); however, for larger overshoots, a supply with lower variability will be preferred.