SNVA935A June   2020  – July 2021 LM60430 , LM60430-Q1 , LM60440 , LM60440-Q1

 

  1.   Trademarks
  2. 1Introduction
  3. 2Enhanced HotRod QFN – Optimized EMI Performance
    1. 2.1 Introduction
    2. 2.2 Enhanced HotRod QFN Package
    3. 2.3 Enhanced HotRod QFN Pin-Out
    4. 2.4 Comparative Analysis of EMI Results between FCOL Package and Enhanced HotRod QFN Package
  4. 3Enhanced HotRod QFN - Optimized for Manufacturing
  5. 4Enhanced HotRod QFN - Optimized for Thermals
    1. 4.1 Introduction
    2. 4.2 Enhanced HotRod QFN Thermal Performance
  6. 5Summary
  7. 6References
  8. 7Revision History

4.1 Introduction

As discussed through this application note, one of the tradeoffs between the QFN package technology and FCOL package technology is the thermal performance. The Enhanced HotRod QFN package leverages a PowerPad to increase thermal dissipation through this ground connection. Section 4.2 will quantify the thermal advantage of the PowerPAD with the LM60440.