SBOSAD7 april   2023 TLV9161-Q1 , TLV9162-Q1 , TLV9164-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information for Single Channel
    5. 6.5 Thermal Information for Dual Channel
    6. 6.6 Thermal Information for Quad Channel
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Protection Circuitry
      2. 7.3.2 EMI Rejection
      3. 7.3.3 Thermal Protection
      4. 7.3.4 Capacitive Load and Stability
      5. 7.3.5 Common-Mode Voltage Range
      6. 7.3.6 Phase Reversal Protection
      7. 7.3.7 Electrical Overstress
      8. 7.3.8 Overload Recovery
      9. 7.3.9 Typical Specifications and Distributions
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Low-Side Current Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 TINA-TI (Free Software Download)
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • AEC-Q100 qualified for automotive applications
    • Temperature grade 1: –40°C to +125°C, TA
    • Device HBM ESD classification level 3A
      (≥2500 V)
    • Device CDM ESD classification level C3
      (≥1500 V)
  • Low offset voltage: ±210 µV
  • Low offset voltage drift: ±0.25 µV/°C
  • Low noise: 6.8 nV/√Hz at 1 kHz, 4.2 nV/√Hz broadband
  • High common-mode rejection: 110 dB
  • Low bias current: ±10 pA
  • Rail-to-rail input and output
  • Wide bandwidth: 11-MHz GBW, unity-gain stable
  • High slew rate: 33 V/µs
  • Low quiescent current: 2.4 mA per amplifier
  • Wide supply: ±1.35 V to ±8 V, 2.7 V to 16 V
  • Robust EMIRR performance