Former National device marking information

Texas Instruments marks some devices formerly sold by National Semiconductor differently than other TI parts in an effort to provide clear device identification and manufacturing traceability information. The method of presenting the information marked on the device is dependent on the device package size and area available for marking, and the nature or specifications of the device.

The information presented below describes the majority of the device markings that a customer will observe. Specific package marking is provided on a device-by-device basis, but general marking conventions are outlined to help understand device markings similar to those in the examples to the right.

The links below discuss general marking conventions to help understand device markings similar to those in the examples to the right.

Special codes

Actual top mark content may vary from the web definition. The special codes below are decoded to the actual characters for part marking. National markings may include specific characters to better identify products. For example "DD" Die Step Rev may consist of one or two "C" or "AA" reference in the part marking. Another example, "BBBBB" is a 5 digit Die Revision Number may be decoded as "43ABE" for the actual characters.

  • XXYY = 4-Digit Datecode
  • TT = 2-Digit D/Run
  • E# = Lead Finish Category * (E0 - E7 per JESD97)
  • BBBBB =  Five Digit Dierun Code
  • DD   =  1 or 2 Digit Diestep Rev
  • SS   =  Wafer Sort Code
  • C    =  Copyright Symbol C Within a Circle
  • M    =  M Inscribed Within A Circle
  • >    =  ESD Symbol
  • EP = Enhanced Plastic Identification
  • A    =  Inspection Lot Number
  • DIE-RUN-## = 10 Digit Wafer Lot/Die Run Number
  • I  =  Micro SMD Pin 1 Designator
  • V = Micro SMD 1-Digit D/Run or + plus sign for "ES" Engineering Sample

* - If space permits

Standard first line manufacturing information

The first line of device marking provides manufacturing information as shown in the schematic.

Small component first line manufacturing information

On smaller packages, such as SOICs, 8-lead MDIPs, and 20-lead PLCCs, the information is encoded somewhat differently to accommodate the smaller area available as shown in the schematic.

Typical device descriptions (Second line)

The second line of marking describes the specific circuit in the package. The schematics show information shown for typical parts as well as programmable devices.

Automotive grade products will have a unique NSID. The letter "Q" will be added to the standard commercial product marking of the NSID. See the schematics below.

Optional third and fourth line information

Depending on the device, package size, and customer, additional information might appear in a third or fourth line of marking information. Information that might appear on these lines includes:

  • Continuation of device identification (if too long for the second line)
  • "Stampoff" number as required by specific customer request and specification
  • Notice(s) related to copyright (©) or trademarks (™, ®)

Very small component marking

Certain very small packages, such as SOT-23, SOT-223, SC70, and SC90, are too small to contain all the information discussed above. Device identification marking is assigned differently and can be found in the Availability, Models, Samples & Pricing section of each device's Part Number link from TI’s home page. Other date code information, which would be typically found in the "first line" marking, is identified on the container labels.

Enhanced plastic

National's enhanced plastic (EP) products are for system requirements which dictate an upgrade from standard commercial off the shelf product (COTS), but don't need the additional requirements associated with QML systems. EP products give customers the means to facilitate their internal qualification of COTS devices, by making available: extended temperature ranges, qualification data, reliability data and baseline control, and more.

Additional marking

With the wide range of product previously produced by National, additional marking is sometimes needed to indicate a different level of performance or to identify specific functionality. For example, some marks that might occur after the package code or die run code might include the following:

  • Special reliability processing (/A+)
  • Processing to MIL-STD-883C (/883)
  • Indication of adjustable output device (-ADJ)
  • Indication of output voltage level (-5.0)
  • Indication of operation frequency (-33)
  • Marketing status code (ES)
  • Other information as discussed above

As always, the best source for final confirmation of marking interpretation is to review the information available in the device product folders which can be searched from TI’s home page.

Die run codes

The die run code is a two letter alpha code automatically assigned to each lot by an internal manufacturing system. In case of any device problems, this code facilitates backward traceability to manufacturing processes where containment and corrective actions can be defined. These actions, in turn, minimize, and eventually eliminate any negative impact on customers.

Device families, product lines and device types

Basic device identification is usually provided in the second line of device marking. As indicated, the general form of the identification is a product line indicator along with a numeric description of the specific device. The table below lists a sampling of device family codes. A full listing of devices, organized by device family prefixes, can be found on TI’s home page.

 

Code Product Family
ADC Data Conversion
CGS Clock Generation Support
COP Control Oriented Processor
DAC Data Conversion
DP Local Area Network Products
Code Product Family
DS Interface Products
LM Linear
LMX Frequency Synthesizers / PLL
LP Voltage Regulators
PC PC Related Products

Electrical grade information

When present, additional markings between the device identification characters and package code represent device variations that can be thought of as "grade levels" of the product. These might represent:

  • Improved precision
  • An improved die revision
  • Wider or more narrow specification range
  • Accuracy vs temperature levels

The exact nature of the variations are defined in product datasheets which can be found through search from TI’s home page.

Temperature range codes

The temperature range over which a device's operation is specified may vary over different versions of the basic device. In these cases, a temperature range code indicates the specified range. While the list below lists the most common ranges specified, customers are urged to confirm this data on the datasheets accessible in the TI product folders.

  • 0°C to +70°C (Code C)
  • -40°C to +85°C (Code I)
  • -55°C to +125°C (No code)

Packaging codes

Package options are also available for each device type can be viewed in our packaging search tool. Links are available to obtain detailed information on each package type such as mechanical and thermal specifications.

A small sample of packaging codes found within the device description marking is given in the table below:

Code Package
H TO-5 / TO-46
J CERDIP
M SOP / SOIC
MX SOP Tape & Reel
N Molded DIP
Code Package
S TO-263
T TO-220
U Pin Grid Array
V Plastic Chip Carrier (PCC)
VF Quad Flat Pak (PQFP)

ROM marking codes

Products such as single-chip microcontrollers use the same basic device with different on-board programming to achieve a wide-range of functionality. ROM code marking identifies a specific device according to the internal programming.