SNOSCS3B September   2013  – March 2014 LMP91300

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Terminal Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Oscillator
      2. 7.3.2  Detection
      3. 7.3.3  Comparator
      4. 7.3.4  Low RP, Close Target, Under Range Switch Enable
      5. 7.3.5  Programming The Switching Point And Hysteresis
      6. 7.3.6  Temperature Compensation
      7. 7.3.7  Power Supply
      8. 7.3.8  LED Drive
      9. 7.3.9  SWDRV
      10. 7.3.10 Overload Protection
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Burning Programmed Values Into The Registers
      2. 7.5.2 Single-Wire Interface (SWIF)
        1. 7.5.2.1 Write Operation
        2. 7.5.2.2 Read Operation
      3. 7.5.3 Usage Priority Of Registers
    6. 7.6 Register Maps
      1. 7.6.1  DET_H_MSB_INIT - Detection High Threshold MSB (Initial) (Address 0x66)
      2. 7.6.2  DET_H_LSB_INIT - Detection High Threshold LSB (Initial) (Address 0x67)
      3. 7.6.3  DET_L_MSB_INIT - Detection Low Threshold MSB (Initial) (Address 0x68)
      4. 7.6.4  DET_L_LSB_INIT - Detection Low Threshold LSB (Initial) (Address 0x69)
      5. 7.6.5  INFO0 - Device Information 0 (Address 0x6A)
      6. 7.6.6  INFO1 - Device Information 1 (Address 0x6B)
      7. 7.6.7  INFO2 - Device Information 2 (Address 0x6C)
      8. 7.6.8  INFO3 - Device Information 3 (Address 0x6D)
      9. 7.6.9  OSC_CONFIG_0 - Oscillator Configuration 0 Register (Address 0x6E)
      10. 7.6.10 45
      11. 7.6.11 OSC_CONFIG_1 - Oscillator Configuration 1 Register (Address 0x6F)
      12. 7.6.12 OSC_CONFIG_2 - Oscillator Configuration 2 Register (Address 0x70)
      13. 7.6.13 OSC_CONFIG_3_INIT - Oscillator Configuration 3 Register (Initial) (Address 0x71)
      14. 7.6.14 OUT_CONFIG_INIT - Output Configuration Register (Initial) (Address 0x72)
      15. 7.6.15 DET_H_MSB_FNL - Detection High Threshold MSB (Final) (Address 0x73)
      16. 7.6.16 DET_H_LSB_FNL - Detection High Threshold LSB (Final) (Address 0x74)
      17. 7.6.17 DET_L_MSB_FNL - Detection Low Threshold MSB (Final) (Address 0x75)
      18. 7.6.18 DET_L_LSB_FNL - Detection Low Threshold LSB (Final) (Address 0x76)
      19. 7.6.19 OSC_CONFIG_3_FNL - Oscillator Configuration 3 Register (Final) (Address 0x77)
      20. 7.6.20 OUT_CONFIG_FNL - Output Configuration Register (Final) (Address 0x78)
      21. 7.6.21 TEMP64 - Temperature In °C + 64 (Address 0x79)
      22. 7.6.22 PROXIMITY_MSB - Proximity MSB (Address 0x7A)
      23. 7.6.23 PROXIMITY_LSB - Proximity LSB (Address 0x7B)
      24. 7.6.24 STATUS - Device Status (Address 0x7E)
      25. 7.6.25 BURN_REQ - Burn Request (Address 0x7F)
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Quick Start
        2. 8.2.2.2  Determining The RP of an LC Tank
        3. 8.2.2.3  Component Selection And Layout
        4. 8.2.2.4  CF (CFA and CFB Terminals)
        5. 8.2.2.5  NTC (TEMP+ Terminal)
        6. 8.2.2.6  C1
        7. 8.2.2.7  CV+/EXT E
        8. 8.2.2.8  CBY (CBY Terminal)
        9. 8.2.2.9  RSENSE
        10. 8.2.2.10 REXT B (EXT B Terminal):
        11. 8.2.2.11 R1
        12. 8.2.2.12 SENSE1+ And SENSE2+ Terminals (RSENSE1+, RSENSE2+)
        13. 8.2.2.13 NPN
        14. 8.2.2.14 PNP
        15. 8.2.2.15 LED
        16. 8.2.2.16 LC Tank and INA and INB Terminals
        17. 8.2.2.17 SWDRV Terminal
        18. 8.2.2.18 P1 To P5 Terminals
        19. 8.2.2.19 GND Terminals
        20. 8.2.2.20 NC Terminals
        21. 8.2.2.21 Exposed DAP
        22. 8.2.2.22 SENSE-
      3. 8.2.3 Look-Up Table Calibration
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings (1)

Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Voltage at Terminals 1-5, 7, 10, 11, 17, 18 (B1, B2, B4, C1, C2, C3, C4, D2, D4, E2) (V+) + 0.3 V
Voltage at Terminals 6, 15, 19, 22 (B3, D3) 0.3 V
Voltage at Terminal 8 (E4) 6 V
Voltage at Terminal 9 (E3) 7 V
Voltage at Terminals 12, 13 (D1, E1) 48 V
Current at Terminals 20, 21 (A1, A2) 8 mA
Voltage at Terminals 23, 24 (A3, A4) 1.6 V
Operating Temperature, TA −40 +125 °C
Junction Temperature, TJ(2) +150 °C

6.2 Handling Ratings

MIN MAX UNIT
TSTG Storage Temperature −65 +150 °C
HBM(1)(2) Human Body Model 2000 V
CDM(1)(3) Charge-Device Model 500 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VLOOP Loop Voltage 6.5 40 V

6.4 Thermal Information(2)(3)

Over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
θJA Package Thermal Impedance 24-Terminal WQFN 33.2 °C/W
θJA Package Thermal Impedance 20-Terminal DSBGA 46 °C/W

6.5 Electrical Characteristics (4)(5)

Unless otherwise specified, all limits are ensured at TA = TJ = 25°C, Loop Voltage = 24V.(8). Boldface limits apply at the temperature extremes.
SYMBOL PARAMETER CONDITIONS MIN
(7)		 TYP
(6)		 MAX
(7)		 UNIT
POWER SUPPLY
IV+ Supply Current Does not include external currents such as LED, SWDRV, and LC tank current(9)(8) 3 mA
IBURN Burn Current Additional current needed to burn registers 3.6 mA
tSTART Power On Start Time LC Tank oscillation = 1MHz, RESPONSE_TIME = 001b (96), measured time starting from when supply is at 90% of operational value.(10) 50 ms
OSCILLATOR
fMIN Minimum Oscillation Frequency 0.005 MHz
fMAX Maximum Oscillation Frequency 5 MHz
OSCAMP1V Oscillator Amplitude OSC_AMP = 00b 1 VPP
OSCAMP2V Oscillator Amplitude OSC_AMP = 01b 2 VPP
OSCAMP4V Oscillator Amplitude OSC_AMP = 10b 4 VPP
trec Recovery Time Oscillation start up time after low RP is removed. 10 oscillator periods
SENSOR
RPMIN Minimum RP Value of LC Tank See OSC_CONFIG_2 entry in the Register Maps section. 798 Ω
RPMAX Maximum RP Value of LC Tank See OSC_CONFIG_2 entry in the Register Maps section. 3.93M Ω
DETECTOR
tRESP Response time Settling time of digital filter to RP step. See RESPONSE_TIME in registers 0x71 and 0x77. 96 6144 oscillator periods
OUTPUT DRIVER
ISOURCE, SINK Current source and sink capability on SWDRV Terminal SWDRV_CURRENT = 00b 2 2.5 3 mA
SWDRV_CURRENT = 01b 3.25 3.75 4.25
SWDRV_CURRENT = 10b 4.5 5 5.5
SWDRV_CURRENT = 11b 9 10 11
OVERLOAD PROTECTION
Over Current Detection Threshold NPN Configuration, Using external SENSE resistor 279 310 341 mV
Over Current Detection Threshold PNP Configuration, Using external SENSE resistor 248 310 376 mV
Over Current Limit NPN Configuration 432 480 528 mV
Over Current Limit PNP Configuration 413 480 547 mV
INPUT SHORT CONDITION
tOUT Output Switching Output high time in short condition 25 30 35 µs
duty0.1% Output duty cycle during short condition During short, SHORTCKT_DUTY_CYCLE = 0b 0.1%
duty0.8% Output duty cycle during short condition During short, SHORTCKT_DUTY_CYCLE = 1b 0.8%
LEDBLINK LED Blinking Rate Blinking rate of the LED during a short condition or ECC error 2 Hz
LED DRIVER
Sink Current LED_CURRENT = 0b 2 2.5 3 mA
Sink Current LED_CURRENT = 1b 4 5 6 mA
TEMPERATURE SENSOR
Accuracy Accuracy of the LMP91300 only, does not include the accuracy of the NTC -2.5 1 2.5 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(MAX), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(MAX) - TA)/ θJA . All numbers apply for packages soldered directly onto a PC board.
(3) The package thermal impedance is calculated in accordance with JESD 51-7.
(4) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very limited self-heating of the device such that TJ = TA. Parametric performance shown in the electrical tables is not ensured under conditions of internal self-heating where TJ > TA.
(5) Electrical Characteristics apply only when SWIF is inactive. Glitches may appear on SWDRV during a SWIF transmission.
(6) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary over time and will also depend on the application and configuration. The typical values are not tested and are not ensured on shipped production material.
(7) Limits are ensured by testing, design, or statistical analysis at 25°C. Limits over the operating temperature range are ensured through correlations using statistical quality control (SQC) method.
(8) There are tradeoffs between power consumption, switching speed, RP to Digital conversion and oscillation frequency.
(9) Supply current is higher when there is not an LC tank connected to Terminals INA and INB because an internal protection circuit is enabled. See the Supply Current vs Supply Voltage graphs in the Typical Characteristics section.
(10) The loop supply must be able to momentarily supply 30mA.

6.6 Timing Requirements

SWIF TIMING MIN TYP MAX UNIT
Communication rate 1 10 kbits/s
“D” symbol duty cycle: THD/TP ½
“0” symbol duty cycle: TH0/TP ¼
“1” symbol duty cycle: TH1/TP ¾
30200802.gifFigure 1. Single-Wire Interface (SWIF) Timing Diagram

6.7 Typical Characteristics

At TA = TJ = 25°C, Loop Voltage = 20V to 36V, unless otherwise specified.
C003_SNOSCS3.png
Figure 2. RP Resolution
C005_SNOSCS3.png
Figure 4. Supply Current vs Supply Voltage
C007_SNOSCS3.png
Figure 6. Supply Current vs Supply Voltage
C011_SNOSCS3.pngFigure 8. 0.1% Duty Cycle Distribution, PNP Mode
C013_SNOSCS3.pngFigure 10. 0.8% Duty Cycle Distribution, PNP Mode
C004_SNOSCS3.png
Figure 3. Temperature Accuracy
C006_SNOSCS3.png
Figure 5. Supply Current vs Supply Voltage
C008_SNOSCS3.png
Figure 7. SWDRV and SENSE- Waveforms During Short Condition, SHORTCKT_DUTY_CYCLE = 0.1% Or 0.8%
C012_SNOSCS3.pngFigure 9. 0.1% Duty Cycle Distribution, NPN Mode
C014_SNOSCS3.pngFigure 11. 0.8% Duty Cycle Distribution, NPN Mode
C009_SNOSCS3.pngFigure 12. SWDRV and SENSE- Waveforms During Short Condition, SHORTCKT_DUTY_CYCLE = 0.1%
C010_SNOSCS3.pngFigure 13. SWDRV and SENSE- Waveforms During Short Condition, SHORTCKT_DUTY_CYCLE = 0.8%