SCPS260A August 2017  – September 2017 TIC12400-Q1

PRODUCTION DATA. 

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Timing Requirements
    7. 6.7Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1Overview
    2. 8.2Functional Block Diagram
    3. 8.3Feature Description
      1. 8.3.1 VS Pin
      2. 8.3.2 VDD Pin
      3. 8.3.3 Device Initialization
      4. 8.3.4 Device Trigger
      5. 8.3.5  Device Reset
        1. 8.3.5.1VS Supply POR
        2. 8.3.5.2Hardware Reset
        3. 8.3.5.3Software Reset
      6. 8.3.6 VS Under-Voltage (UV) Condition
      7. 8.3.7 VS Over-Voltage (OV) Condition
      8. 8.3.8 Switch Inputs Settings
        1. 8.3.8.1Input Current Source/Sink Selection
        2. 8.3.8.2Input Mode Selection
        3. 8.3.8.3Input Enable Selection
        4. 8.3.8.4Thresholds Adjustment
        5. 8.3.8.5Wetting Current Configuration
      9. 8.3.9 Interrupt Generation and INT Assertion
        1. 8.3.9.1INT Pin Assertion Scheme
        2. 8.3.9.2Interrupt Idle Time (tINT_IDLE) Time
        3. 8.3.9.3Microcontroller Wake-Up
        4. 8.3.9.4Interrupt Enable / Disable And Interrupt Generation Conditions
        5. 8.3.9.5Detection Filter
      10. 8.3.10Temperature Monitor
        1. 8.3.10.1Temperature Warning (TW)
        2. 8.3.10.2Temperature Shutdown (TSD)
      11. 8.3.11Parity Check And Parity Generation
      12. 8.3.12Cyclic Redundancy Check (CRC)
    4. 8.4Device Functional Modes
      1. 8.4.1Continuous Mode
      2. 8.4.2Polling Mode
        1. 8.4.2.1Standard Polling
        2. 8.4.2.2Matrix polling
      3. 8.4.3Additional Features
        1. 8.4.3.1Clean Current Polling (CCP)
        2. 8.4.3.2Wetting Current Auto-Scaling
        3. 8.4.3.3VS Measurement
        4. 8.4.3.4Wetting Current Diagnostic
        5. 8.4.3.5ADC Self-Diagnostic
    5. 8.5Programming
      1. 8.5.1SPI Communication Interface Buses
        1. 8.5.1.1Chip Select (CS)
        2. 8.5.1.2System Clock (SCLK)
        3. 8.5.1.3Slave In (SI)
        4. 8.5.1.4Slave Out (SO)
      2. 8.5.2SPI Sequence
        1. 8.5.2.1Read Operation
        2. 8.5.2.2Write Operation
        3. 8.5.2.3Status Flag
    6. 8.6REGISTER_MAPS
      1. 8.6.1 DEVICE_ID register (Offset = 1h) [reset = 20h]
      2. 8.6.2 INT_STAT Register (Offset = 2h) [reset = 1h]
      3. 8.6.3 CRC Register (Offset = 3h) [reset = FFFFh]
      4. 8.6.4 IN_STAT_MISC Register (Offset = 4h) [reset = 0h]
      5. 8.6.5 IN_STAT_COMP Register (Offset = 5h) [reset = 0h]
      6. 8.6.6 IN_STAT_ADC0 Register (Offset = 6h) [reset = 0h]
      7. 8.6.7 IN_STAT_ADC1 Register (Offset = 7h) [reset = 0h]
      8. 8.6.8 IN_STAT_MATRIX0 Register (Offset = 8h) [reset = 0h]
      9. 8.6.9 IN_STAT_MATRIX1 Register (Offset = 9h) [reset = 0h]
      10. 8.6.10ANA_STAT0 Register (Offset = Ah) [reset = 0h]
      11. 8.6.11ANA_STAT1 Register (Offset = Bh) [reset = 0h]
      12. 8.6.12ANA_STAT2 Register (Offset = Ch) [reset = 0h]
      13. 8.6.13ANA_STAT3 Register (Offset = Dh) [reset = 0h]
      14. 8.6.14ANA_STAT4 Register (Offset = Eh) [reset = 0h]
      15. 8.6.15ANA_STAT5 Register (Offset = Fh) [reset = 0h]
      16. 8.6.16ANA_STAT6 Register (Offset = 10h) [reset = 0h]
      17. 8.6.17ANA_STAT7 Register (Offset = 11h) [reset = 0h]
      18. 8.6.18ANA_STAT8 Register (Offset = 12h) [reset = 0h]
      19. 8.6.19ANA_STAT9 Register (Offset = 13h) [reset = 0h]
      20. 8.6.20ANA_STAT10 Register (Offset = 14h) [reset = 0h]
      21. 8.6.21ANA_STAT11 Register (Offset = 15h) [reset = 0h]
      22. 8.6.22ANA_STAT12 Register (Offset = 16h) [reset = 0h]
      23. 8.6.23CONFIG Register (Offset = 1Ah) [reset = 0h]
      24. 8.6.24IN_EN Register (Offset = 1Bh) [reset = 0h]
      25. 8.6.25CS_SELECT Register (Offset = 1Ch) [reset = 0h]
      26. 8.6.26WC_CFG0 Register (Offset = 1Dh) [reset = 0h]
      27. 8.6.27WC_CFG1 Register (Offset = 1Eh) [reset = 0h]
      28. 8.6.28CCP_CFG0 Register (Offset = 1Fh) [reset = 0h]
      29. 8.6.29CCP_CFG1 Register (Offset = 20h) [reset = 0h]
      30. 8.6.30THRES_COMP Register (Offset = 21h) [reset = 0h]
      31. 8.6.31INT_EN_COMP1 Register (Offset = 22h) [reset = 0h]
      32. 8.6.32INT_EN_COMP2 Register (Offset = 23h) [reset = 0h]
      33. 8.6.33INT_EN_CFG0 Register (Offset = 24h) [reset = 0h]
      34. 8.6.34INT_EN_CFG1 Register (Offset = 25h) [reset = 0h]
      35. 8.6.35INT_EN_CFG2 Register (Offset = 26h) [reset = 0h]
      36. 8.6.36INT_EN_CFG3 Register (Offset = 27h) [reset = 0h]
      37. 8.6.37INT_EN_CFG4 Register (Offset = 28h) [reset = 0h]
      38. 8.6.38THRES_CFG0 Register (Offset = 29h) [reset = 0h]
      39. 8.6.39THRES_CFG1 Register (Offset = 2Ah) [reset = 0h]
      40. 8.6.40THRES_CFG2 Register (Offset = 2Bh) [reset = 0h]
      41. 8.6.41THRES_CFG3 Register (Offset = 2Ch) [reset = X]
      42. 8.6.42THRES_CFG4 Register (Offset = 2Dh) [reset = X]
      43. 8.6.43THRESMAP_CFG0 Register (Offset = 2Eh) [reset = 0h]
      44. 8.6.44THRESMAP_CFG1 Register (Offset = 2Fh) [reset = 0h]
      45. 8.6.45THRESMAP_CFG2 Register (Offset = 30h) [reset = 0h]
      46. 8.6.46Matrix Register (Offset = 31h) [reset = 0h]
      47. 8.6.47Mode Register (Offset = 32h) [reset = 0h]
    7. 8.7Programming Guidelines
  9. Application and Implementation
    1. 9.1Application Information
    2. 9.2Using TIC12400-Q1 in a 12 V Automotive System
    3. 9.3Resistor-coded Switches Detection in Automotive Body Control Module
      1. 9.3.1Design Requirements
      2. 9.3.2Detailed Design Procedure
      3. 9.3.3Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1Layout Guidelines
    2. 11.2Layout Example
  12. 12Device and Documentation Support
    1. 12.1Receiving Notification of Documentation Updates
    2. 12.2Community Resources
    3. 12.3Trademarks
    4. 12.4Electrostatic Discharge Caution
    5. 12.5Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Features

  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C4B
  • Designed to Support 12-V Automotive Systems with Over-voltage and Under-voltage Warning
  • Monitors up to 24 Direct Switch Inputs with 10 Inputs Configurable to Monitor Switches Connected to Either Ground or Battery
  • Switch Input Withstands up to 40 V (Load Dump Condition) and down to –24 V (Reverse Polarity Condition)
  • 6 Configurable Wetting Current Settings:
    (0 mA, 1 mA, 2 mA, 5 mA, 10 mA, and 15 mA)
  • Integrated 10-bit ADC for Multi-Position Analog Switch Monitoring
  • Integrated Comparator with 4 Programmable Thresholds for Digital Switch Monitoring
  • Ultra-low Operating Current in Polling Mode:
    68 μA Typical (tPOLL = 64 ms, tPOLL_ACT = 128 μs,
    All 24 Inputs Active, Comparator Mode, All Switches Open)
  • Interfaces Directly to MCU Using 3.3 V / 5 V Serial Peripheral Interface (SPI) Protocol
  • Interrupt Generation to Support Wake-Up Operation on All Inputs
  • Integrated Battery and Temperature Sensing
  • ±8 kV Contact Discharge ESD Protection on Input Pins per ISO-10605 With Appropriate External Components
  • 38-Pin TSSOP Package

Applications

  • Body Control Module and Gateway
  • Automotive Lighting
  • Heating and Cooling
  • Power Seats
  • Mirrors

Description

The TIC12400-Q1 is an advanced Multiple Switch Detection Interface (MSDI) designed to detect external switch status in a 12-V automotive system. The TIC12400-Q1 features an integrated 10-bit ADC to monitor multi-position analog switches and a comparator to monitor digital switches independently of the MCU. Detection thresholds can be programmed for the ADC and the comparator to support various switch topologies and system non-idealities. The device monitors 24 direct switch inputs, with 10 inputs configurable to monitor switches connected to either ground or battery. 6 unique wetting current settings can be programmed for each input to support different application scenarios. The device supports wake-up operation on all switch inputs to eliminate the need to keep the MCU active continuously, thus reducing power consumption of the system. The TIC12400-Q1 also offers integrated fault detection, ESD protection, and diagnostic functions for improved system robustness. The TIC12400-Q1 supports 2 modes of operations: continuous and polling mode. In continuous mode, wetting current is supplied continuously. In polling mode, wetting current is turned on periodically to sample the input status based on a programmable timer, thus the system power consumption is significantly reduced.

Device Information(1)

PART NUMBERPACKAGEBODY SIZE (NOM)
TIC12400-Q1TSSOP (38)9.70 mm x 4.40 mm
  1. For all available packages, see the orderable addendum at the end of the data sheet.

Simplified Schematic

TIC12400-Q1 schem-01-scps260.gif