SWRS152M July 2013  – October 2017 WL1801MOD , WL1805MOD , WL1831MOD , WL1835MOD

PRODUCTION DATA. 

  1. 1Device Overview
    1. 1.1Features
    2. 1.2Applications
    3. 1.3Description
    4. 1.4Functional Block Diagram
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1Pin Attributes
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 External Digital Slow Clock Requirements
    5. 5.5 Thermal Resistance Characteristics for MOC 100-Pin Package
    6. 5.6 WLAN Performance: 2.4-GHz Receiver Characteristics
    7. 5.7 WLAN Performance: 2.4-GHz Transmitter Power
    8. 5.8 WLAN Performance: Currents
    9. 5.9 Bluetooth Performance: BR, EDR Receiver Characteristics—In-Band Signals
    10. 5.10Bluetooth Performance: Transmitter, BR
    11. 5.11Bluetooth Performance: Transmitter, EDR
    12. 5.12Bluetooth Performance: Modulation, BR
    13. 5.13Bluetooth Performance: Modulation, EDR
    14. 5.14Bluetooth low energy Performance: Receiver Characteristics - In-Band Signals
    15. 5.15Bluetooth low energy Performance: Transmitter Characteristics
    16. 5.16Bluetooth low energy Performance: Modulation Characteristics
    17. 5.17Bluetooth BR and EDR Dynamic Currents
    18. 5.18Bluetooth low energy Currents
    19. 5.19Timing and Switching Characteristics
      1. 5.19.1Power Management
        1. 5.19.1.1Block Diagram - Internal DC-DCs
      2. 5.19.2Power-Up and Shut-Down States
      3. 5.19.3Chip Top-level Power-Up Sequence
      4. 5.19.4WLAN Power-Up Sequence
      5. 5.19.5Bluetooth-Bluetooth low energy Power-Up Sequence
      6. 5.19.6WLAN SDIO Transport Layer
        1. 5.19.6.1SDIO Timing Specifications
        2. 5.19.6.2SDIO Switching Characteristics - High Rate
      7. 5.19.7HCI UART Shared-Transport Layers for All Functional Blocks (Except WLAN)
        1. 5.19.7.1UART 4-Wire Interface - H4
      8. 5.19.8Bluetooth Codec-PCM (Audio) Timing Specifications
  6. 6Detailed Description
    1. 6.1WLAN Features
    2. 6.2Bluetooth Features
    3. 6.3Bluetooth low energy Features
    4. 6.4Device Certification
      1. 6.4.1FCC Certification and Statement
      2. 6.4.2Innovation, Science, and Economic Development Canada (ISED)
      3. 6.4.3ETSI/CE
      4. 6.4.4MIC Certification
    5. 6.5Module Markings
    6. 6.6Test Grades
    7. 6.7End Product Labeling
    8. 6.8Manual Information to the End User
  7. 7Applications, Implementation, and Layout
    1. 7.1Application Information
      1. 7.1.1Typical Application - WL1835MODGB Reference Design
      2. 7.1.2Design Recommendations
      3. 7.1.3RF Trace and Antenna Layout Recommendations
      4. 7.1.4Module Layout Recommendations
      5. 7.1.5Thermal Board Recommendations
      6. 7.1.6Baking and SMT Recommendations
        1. 7.1.6.1Baking Recommendations
        2. 7.1.6.2SMT Recommendations
  8. 8Device and Documentation Support
    1. 8.1Device Support
      1. 8.1.1Third-Party Products Disclaimer
      2. 8.1.2Development Support
        1. 8.1.2.1Tools and Software
      3. 8.1.3Device Support Nomenclature
    2. 8.2Related Links
    3. 8.3Community Resources
    4. 8.4Trademarks
    5. 8.5Electrostatic Discharge Caution
    6. 8.6Glossary
  9. 9Mechanical, Packaging, and Orderable Information
    1. 9.1TI Module Mechanical Outline
    2. 9.2Tape and Reel Information
      1. 9.2.1Tape and Reel Specification
      2. 9.2.2Packing Specification
        1. 9.2.2.1Reel Box
        2. 9.2.2.2Shipping Box
    3. 9.3Packaging Information

Device Overview

Features

  • General
    • Integrates RF, Power Amplifiers (PAs), Clock, RF Switches, Filters, Passives, and Power Management
    • Quick Hardware Design With TI Module Collateral and Reference Designs
    • Operating Temperature: –20°C to +70°C
    • Small Form Factor: 13.3 × 13.4 × 2 mm
    • 100-Pin MOC Package
    • FCC, IC, ETSI/CE, and TELEC Certified With PCB, Dipole, Chip, and PIFA Antennas
  • Wi-Fi®
    • WLAN Baseband Processor and RF Transceiver Support of IEEE Std 802.11b, 802.11g, and 802.11n
    • 20- and 40-MHz SISO and 20-MHz 2 × 2 MIMO at 2.4 GHz for High Throughput: 80 Mbps (TCP), 100 Mbps (UDP)
    • 2.4-GHz MRC Support for Extended Range
    • Fully Calibrated: Production Calibration Not Required
    • 4-Bit SDIO Host Interface Support
    • Wi-Fi Direct Concurrent Operation (Multichannel, Multirole)
  • Bluetooth® and Bluetooth low energy (WL183xMOD Only)
    • Bluetooth 4.2 Secure Connection Compliant and CSA2 Support (Declaration ID: D032799)
    • Host Controller Interface (HCI) Transport for Bluetooth Over UART
    • Dedicated Audio Processor Support of SBC Encoding + A2DP
    • Dual-Mode Bluetooth and Bluetooth Low Energy
    • TI's Bluetooth- and Bluetooth Low Energy-Certified Stack
  • Key Benefits
    • Reduces Design Overhead
    • Differentiated Use Cases by Configuring WiLink™ 8 Simultaneously in Two Roles (STA and AP) to Connect Directly With Other Wi-Fi Devices on Different RF Channel (Wi-Fi Networks)
    • Best-in-Class Wi-Fi With High-Performance Audio and Video Streaming Reference Applications With Up to 1.4× the Range Versus One Antenna
    • Different Provisioning Methods for In-Home Devices Connectivity to Wi-Fi in One Step
    • Lowest Wi-Fi Power Consumption in Connected Idle (< 800 µA)
    • Configurable Wake on WLAN Filters to Only Wake Up the System
    • Wi-Fi-Bluetooth Single Antenna Coexistence

Applications

  • Internet of Things (IoT)
  • Multimedia
  • Home Electronics
  • Home Appliances and White Goods
  • Industrial and Home Automation
  • Smart Gateway and Metering
  • Video Conferencing
  • Video Camera and Security

Description

The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux®and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.

Device Information(1)

PART NUMBER PACKAGEBODY SIZE
WL1801MOD QFM (100)13.3 mm × 13.4 mm × 2 mm
WL1805MOD QFM (100)13.3 mm × 13.4 mm × 2 mm
WL1831MODQFM (100)13.3 mm × 13.4 mm × 2 mm
WL1835MODQFM (100)13.3 mm × 13.4 mm × 2 mm
For more information, see Section 9.

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Functional Block Diagram

Figure 1-1 shows a functional block diagram of the WL1835MOD variant.

WL1801MOD WL1805MOD WL1831MOD WL1835MOD WL1835_module_concept_SWRS152.gif
NOTE: Dashed lines indicate optional configurations and are not applied by default.
Figure 1-1 WL1835MOD Functional Block Diagram