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CD54AC244

ACTIVO

Búferes de grado militar de 8 canales, 1.5 V a 5.5 V

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CD54AC244

ACTIVO
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Detalles del producto

Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 24 Supply current (max) (µA) 160 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Rating Military Operating temperature range (°C) -55 to 125
Technology family AC Supply voltage (min) (V) 1.5 Supply voltage (max) (V) 5.5 Number of channels 8 IOL (max) (mA) 24 Supply current (max) (µA) 160 IOH (max) (mA) -24 Input type Standard CMOS Output type Push-Pull Features Standard speed (tpd > 50ns) Rating Military Operating temperature range (°C) -55 to 125
CDIP (J) 20 167.464 mm² 24.2 x 6.92
  • Buffered inputs
  • Typical propagation delay:
       3.6 ns @ VCC = 5 V, TA = 25°C, CL = 50pF
  • Exceeds 2-kV ESD Protection - MIL-STD-883, Method 3015
  • SCR-Latch-up-resistant CMOS process and circuit design
  • Speed of bipolar FAST*/AS/S with significantly reduced power consumption
  • Balanced propagation delays
  • AC types feature 1.5-V to 5.5-V operation and balanced noise immunity at 30% of the supply
  • ± 24-mA output drive current
      Fanout to 15 FAST* ICs
      Drives 50-ohm transmission lines
  • Characterized for operation from –40° to 85°C

*FAST is a Registered Trademark of Fairchild Semiconductor Corp.
  • Buffered inputs
  • Typical propagation delay:
       3.6 ns @ VCC = 5 V, TA = 25°C, CL = 50pF
  • Exceeds 2-kV ESD Protection - MIL-STD-883, Method 3015
  • SCR-Latch-up-resistant CMOS process and circuit design
  • Speed of bipolar FAST*/AS/S with significantly reduced power consumption
  • Balanced propagation delays
  • AC types feature 1.5-V to 5.5-V operation and balanced noise immunity at 30% of the supply
  • ± 24-mA output drive current
      Fanout to 15 FAST* ICs
      Drives 50-ohm transmission lines
  • Characterized for operation from –40° to 85°C

*FAST is a Registered Trademark of Fairchild Semiconductor Corp.

The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output enables (10E\, 2OE\). The CD54/74AC/ACT241 has one active-LOW (10E\) and one active-HIGH (20E) output enable.

The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M and M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and the CD74ACT241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline packages (M and M96 suffixes), and 20-lead shrink small-outline packages (SM96 suffix). These package types are operable over the following temperature ranges: Commercial (0 to 70°C); Industrial (–40 to +85°C); and Extended Industrial/Military (–55 to +125°C).

The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241, and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic packages (F3A suffix) and are operable over the –55 to +125°C temperature range.

The RCA CD54/74AC240, CD54/74AC241, and CD54/74AC244 and the CD54/74ACT240, CD54/74ACT241, and CD54/74ACT244 3-state octal buffer/line drivers use the RCA ADVANCED CMOS technology. The CD54/74AC/ACT240 and CD54/74AC/ACT244 have active-LOW output enables (10E\, 2OE\). The CD54/74AC/ACT241 has one active-LOW (10E\) and one active-HIGH (20E) output enable.

The CD74AC240 and CD74ACT240 are supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M and M96 suffixes). The CD74AC241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and the CD74ACT241 is supplied in 20-lead dual-in-line plastic packages (E suffix) and 20-lead small-outline packages (M96 suffix). The CD74AC244 and CD74ACT244 are supplied in 20-lead dual-in-line plastic packages (E suffix), 20-lead small-outline packages (M and M96 suffixes), and 20-lead shrink small-outline packages (SM96 suffix). These package types are operable over the following temperature ranges: Commercial (0 to 70°C); Industrial (–40 to +85°C); and Extended Industrial/Military (–55 to +125°C).

The CD54AC240 and CD54AC244 and the CD54ACT240, CD54ACT241, and CD54ACT244 are supplied in 20-lead hermetic dual-in-line ceramic packages (F3A suffix) and are operable over the –55 to +125°C temperature range.
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Documentación técnica

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Tipo Título Fecha
* Data sheet CD54/74AC240/241/244, CD54/74ACT240/241/244 datasheet (Rev. B) 19 ene 2004
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
More literature HiRel Unitrode Power Management Brochure 07 jul 2009
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 01 abr 1996

Diseño y desarrollo

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CDIP (J) 20 Ver opciones
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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