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SN74ABT162827A

ACTIVO

Búferes de 20 canales, 4,5 V a 5,5 V con entradas CMOS compatibles con TTL y salidas de 3 estados

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SN74ABT162827A

ACTIVO
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Detalles del producto

Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 20 IOL (max) (mA) 12 Supply current (max) (µA) 32000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family ABT Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 20 IOL (max) (mA) 12 Supply current (max) (µA) 32000 IOH (max) (mA) -12 Input type TTL-Compatible CMOS Output type 3-State Features Balanced outputs, Damping resistors, Over-voltage tolerant inputs, Partial power down (Ioff), Power up 3-state, Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 56 190.647 mm² 18.42 x 10.35 TSSOP (DGG) 56 113.4 mm² 14 x 8.1
  • Members of the Texas Instruments Widebus™ Family
  • Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • High-Impedance State During Power Up and Power Down
  • Typical VOLP (Output Ground Bounce)
        < 1 V at VCC= 5 V, TA = 25°C
  • Distributed VCC and GND Pin Minimizes High-Speed Switching Noise
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Widebus is a trademark of Texas Instruments.
  • Members of the Texas Instruments Widebus™ Family
  • Output Ports Have Equivalent 25- Series Resistors, So No External Resistors Are Required
  • High-Impedance State During Power Up and Power Down
  • Typical VOLP (Output Ground Bounce)
        < 1 V at VCC= 5 V, TA = 25°C
  • Distributed VCC and GND Pin Minimizes High-Speed Switching Noise
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)

Widebus is a trademark of Texas Instruments.

The ’ABT162827A devices are noninverting 20-bit buffers composed of two 10-bit buffers with separate output-enable signals. For either 10-bit buffer, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer are in the high-impedance state.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

To ensure the high-impedance state during power up or power down, OE\ shall be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The ’ABT162827A devices are noninverting 20-bit buffers composed of two 10-bit buffers with separate output-enable signals. For either 10-bit buffer, the two output-enable (1OE1\ and 1OE2\, or 2OE1\ and 2OE2\) inputs must both be low for the corresponding Y outputs to be active. If either output-enable input is high, the outputs of that 10-bit buffer are in the high-impedance state.

The outputs, which are designed to source or sink up to 12 mA, include equivalent 25- series resistors to reduce overshoot and undershoot.

These devices are fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the devices when they are powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

To ensure the high-impedance state during power up or power down, OE\ shall be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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Documentación técnica

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Tipo Título Fecha
* Data sheet SN54ABT162827A, SN74ABT162827A datasheet (Rev. F) 08 jun 2004
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 feb 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 mar 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 dic 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

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Modelo de simulación

SN74ABT162827A Behavioral SPICE Model

SCBM150.ZIP (7 KB) - PSpice Model
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SSOP (DL) 56 Ver opciones
TSSOP (DGG) 56 Ver opciones
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Pedidos y calidad

Información incluida:
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  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
  • Lugar de ensamblaje

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