SN74ABT18502

ACTIVO

Dispositivos de prueba de exploración con transceptores de bus universales de 18 bits

Detalles del producto

Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 4.5 Supply voltage (max) (V) 5.5 Number of channels 18 IOL (max) (mA) 64 IOH (max) (mA) -32 Input type TTL-Compatible CMOS Output type 3-State Features Partial power down (Ioff), Very high speed (tpd 5-10ns) Technology family ABT Rating Catalog Operating temperature range (°C) -40 to 85
LQFP (PM) 64 144 mm² 12 x 12
  • Member of the Texas Instruments Widebus™ Family
  • UBT™ Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Compatible With IEEE Std 1149.1-1990 (JTAG) Test Access Port (TAP) and Boundary-Scan Architecture
  • Includes D-Type Flip-Flops and Control Circuitry to Provide Multiplexed Transmission of Stored and Real-Time Data
  • Two Boundary-Scan Cells (BSCs) Per I/O for Greater Flexibility
  • SCOPE™ Instruction Set
    • IEEE Std 1149.1-1990 Required Instructions, Optional INTEST, and P1149.1A CLAMP and HIGHZ
    • Parallel Signature Analysis (PSA) at Inputs With Masking Option
    • Pseudorandom Pattern Generation (PRPG) From Outputs
    • Sample Inputs/Toggle Outputs (TOPSIP)
    • Binary Count From Outputs
    • Device Identification
    • Even-Parity Opcodes

SCOPE, UBT, and Widebus are trademarks of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • UBT™ Transceiver Combines D-Type Latches and D-Type Flip-Flops for Operation in Transparent, Latched, or Clocked Mode
  • Compatible With IEEE Std 1149.1-1990 (JTAG) Test Access Port (TAP) and Boundary-Scan Architecture
  • Includes D-Type Flip-Flops and Control Circuitry to Provide Multiplexed Transmission of Stored and Real-Time Data
  • Two Boundary-Scan Cells (BSCs) Per I/O for Greater Flexibility
  • SCOPE™ Instruction Set
    • IEEE Std 1149.1-1990 Required Instructions, Optional INTEST, and P1149.1A CLAMP and HIGHZ
    • Parallel Signature Analysis (PSA) at Inputs With Masking Option
    • Pseudorandom Pattern Generation (PRPG) From Outputs
    • Sample Inputs/Toggle Outputs (TOPSIP)
    • Binary Count From Outputs
    • Device Identification
    • Even-Parity Opcodes

SCOPE, UBT, and Widebus are trademarks of Texas Instruments.

The SN74ABT18502 scan test device with an 18-bit universal bus transceiver is a member of the Texas Instruments SCOPE™ testability IC family. This family of devices supports IEEE Std 1149.1-1990 boundary scan to facilitate testing of complex circuit board assemblies. Scan access to the test circuitry is accomplished via the four-wire test access port (TAP) interface.

In the normal mode, this device is an 18-bit universal bus transceiver that combines D-type latches and D-type flip-flops to allow data flow in transparent, latched, or clocked modes. The device can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self test on the boundary test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPE universal bus transceivers.

Data flow in each direction is controlled by output-enable (OEAB\ and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A-bus data is latched while CLKAB is held at a static low or high logic level. Otherwise, if LEAB is low, A-bus data is stored on a low-to-high transition of CLKAB. When OEAB\ is low, the B outputs are active. When OEAB\ is high, the B outputs are in the high-impedance state. B-to-A data flow is similar to A-to-B data flow but uses the OEBA\, LEBA, and CLKBA inputs.

In the test mode, the normal operation of the SCOPE universal bus transceivers is inhibited, and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry performs boundary scan test operations according to the protocol described in IEEE Std 1149.1-1990.

Four dedicated test pins are used to observe and control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry can perform other testing functions such as parallel signature analysis (PSA) on data inputs and pseudorandom pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.

Additional flexibility is provided in the test mode through the use of two boundary-scan cells (BSCs) for each I/O pin. This allows independent test data to be captured and forced at either bus (A or B). A PSA/binary count up (PSA/COUNT) instruction is also included to ease the testing of memories and other circuits where a binary count addressing scheme is useful.

The SN74ABT18502 scan test device with an 18-bit universal bus transceiver is a member of the Texas Instruments SCOPE™ testability IC family. This family of devices supports IEEE Std 1149.1-1990 boundary scan to facilitate testing of complex circuit board assemblies. Scan access to the test circuitry is accomplished via the four-wire test access port (TAP) interface.

In the normal mode, this device is an 18-bit universal bus transceiver that combines D-type latches and D-type flip-flops to allow data flow in transparent, latched, or clocked modes. The device can be used either as two 9-bit transceivers or one 18-bit transceiver. The test circuitry can be activated by the TAP to take snapshot samples of the data appearing at the device pins or to perform a self test on the boundary test cells. Activating the TAP in the normal mode does not affect the functional operation of the SCOPE universal bus transceivers.

Data flow in each direction is controlled by output-enable (OEAB\ and OEBA\), latch-enable (LEAB and LEBA), and clock (CLKAB and CLKBA) inputs. For A-to-B data flow, the device operates in the transparent mode when LEAB is high. When LEAB is low, the A-bus data is latched while CLKAB is held at a static low or high logic level. Otherwise, if LEAB is low, A-bus data is stored on a low-to-high transition of CLKAB. When OEAB\ is low, the B outputs are active. When OEAB\ is high, the B outputs are in the high-impedance state. B-to-A data flow is similar to A-to-B data flow but uses the OEBA\, LEBA, and CLKBA inputs.

In the test mode, the normal operation of the SCOPE universal bus transceivers is inhibited, and the test circuitry is enabled to observe and control the I/O boundary of the device. When enabled, the test circuitry performs boundary scan test operations according to the protocol described in IEEE Std 1149.1-1990.

Four dedicated test pins are used to observe and control the operation of the test circuitry: test data input (TDI), test data output (TDO), test mode select (TMS), and test clock (TCK). Additionally, the test circuitry can perform other testing functions such as parallel signature analysis (PSA) on data inputs and pseudorandom pattern generation (PRPG) from data outputs. All testing and scan operations are synchronized to the TAP interface.

Additional flexibility is provided in the test mode through the use of two boundary-scan cells (BSCs) for each I/O pin. This allows independent test data to be captured and forced at either bus (A or B). A PSA/binary count up (PSA/COUNT) instruction is also included to ease the testing of memories and other circuits where a binary count addressing scheme is useful.

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Documentación técnica

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Tipo Título Fecha
* Data sheet Scan Test Device With 18-Bit Registered Bus Transceiver datasheet 08 feb 2002
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
EVM User's guide LASP Demo Board User's Guide 01 nov 2005
Application note Programming CPLDs Via the 'LVT8986 LASP 01 nov 2005
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
Application note Quad Flatpack No-Lead Logic Packages (Rev. D) 16 feb 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
Selection guide Advanced Bus Interface Logic Selection Guide 09 ene 2001
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B) 01 jun 1997
Application note Designing With Logic (Rev. C) 01 jun 1997
Application note Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A) 01 mar 1997
Application note Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A) 01 dic 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

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Modelo de simulación

BSDL Model of SN74ABT18502

SCTM012.ZIP (3 KB) - BSDL Model
Modelo de simulación

SN74ABT18502 IBIS Model (Rev. A)

SCBM019A.ZIP (15 KB) - IBIS Model
Paquete Pasadores Descargar
LQFP (PM) 64 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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