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Búferes y controladores inversores

SN74AHC16240

ACTIVO

Inversores de 16 canales, 2 V a 5.5 V con salidas de 3 estados

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SN74AHC16240

ACTIVO
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Detalles del producto

Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AHC Supply voltage (min) (V) 2 Supply voltage (max) (V) 5.5 Number of channels 16 IOL (max) (mA) 8 IOH (max) (mA) -8 Supply current (max) (µA) 40 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Very high speed (tpd 5-10ns) Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35 TSSOP (DGG) 48 101.25 mm² 12.5 x 8.1 TVSOP (DGV) 48 62.08 mm² 9.7 x 6.4
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Operating Range 2-V to 5.5-V VCC
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.
  • Members of the Texas Instruments WidebusTM Family
  • EPICTM (Enhanced-Performance Implanted CMOS) Process
  • Operating Range 2-V to 5.5-V VCC
  • Distributed VCC and GND Pins Minimize High-Speed Switching Noise
  • Flow-Through Architecture Optimizes PCB Layout
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages and 380-mil Fine-Pitch Ceramic Flat (WD) Package Using 25-mil Center-to-Center Spacings

EPIC and Widebus are trademarks of Texas Instruments Incorporated.

The 'AHC16240 devices are 16-bit buffers and line drivers designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. They provide inverting outputs and symmetrical active-low output-enable (OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54AHC16240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16240 is characterized for operation from -40°C to 85°C.

The 'AHC16240 devices are 16-bit buffers and line drivers designed specifically to improve the performance and density of 3-state memory address drivers, clock drivers, and bus-oriented receivers and transmitters.

These devices can be used as four 4-bit buffers, two 8-bit buffers, or one 16-bit buffer. They provide inverting outputs and symmetrical active-low output-enable (OE\) inputs.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The SN54AHC16240 is characterized for operation over the full military temperature range of -55°C to 125°C. The SN74AHC16240 is characterized for operation from -40°C to 85°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet 16-Bit Buffers/Drivers With 3-State Outputs datasheet (Rev. G) 25 ene 2000
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 02 dic 2002
Application note Texas Instruments Little Logic Application Report 01 nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 24 feb 2000
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 08 sep 1999
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 01 abr 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 dic 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Live Insertion 01 oct 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Modelo de simulación

SN74AHC16240 Behavioral SPICE Model

SCLM289.ZIP (7 KB) - PSpice Model
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Modelo de simulación

SN74AHC16240 IBIS Model

SCLM083.ZIP (48 KB) - IBIS Model
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Paquete Pasadores Descargar
SSOP (DL) 48 Ver opciones
TSSOP (DGG) 48 Ver opciones
TVSOP (DGV) 48 Ver opciones
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Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Soporte y capacitación

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