SN74ALVCH16334

ACTIVO

Controlador de bus universal de 16 bits con salidas de 3 estados

Detalles del producto

Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 3.6 Number of channels 16 IOL (max) (mA) 24 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Bus-hold, Over-voltage tolerant inputs, Ultra high speed (tpd <5ns) Technology family ALVC Rating Catalog Operating temperature range (°C) -40 to 85
SSOP (DL) 48 164.358 mm² 15.88 x 10.35
  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • Designed to Comply With JEDEC 168-Pin and 200-Pin SDRAM Buffered DIMM Specification
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages

Widebus, EPIC are trademarks of Texas Instruments.

  • Member of the Texas Instruments Widebus™ Family
  • EPIC™ (Enhanced-Performance Implanted CMOS) Submicron Process
  • Designed to Comply With JEDEC 168-Pin and 200-Pin SDRAM Buffered DIMM Specification
  • ESD Protection Exceeds 2000 V Per MIL-STD-883, Method 3015; Exceeds 200 V Using Machine Model (C = 200 pF, R = 0)
  • Latch-Up Performance Exceeds 250 mA Per JESD 17
  • Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors
  • Package Options Include Plastic Shrink Small-Outline (DL), Thin Shrink Small-Outline (DGG), and Thin Very Small-Outline (DGV) Packages

Widebus, EPIC are trademarks of Texas Instruments.

This 16-bit universal bus driver is designed for 1.65-V to 3.6-V VCC operation.

Data flow from A to Y is controlled by the output-enable (OE\) input. The device operates in the transparent mode when the latch-enable (LE\) input is low. When LE\ is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE\ is high, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH16334 is characterized for operation from -40°C to 85°C.

This 16-bit universal bus driver is designed for 1.65-V to 3.6-V VCC operation.

Data flow from A to Y is controlled by the output-enable (OE\) input. The device operates in the transparent mode when the latch-enable (LE\) input is low. When LE\ is high, the A data is latched if the clock (CLK) input is held at a high or low logic level. If LE\ is high, the A data is stored in the latch/flip-flop on the low-to-high transition of CLK. When OE\ is high, the outputs are in the high-impedance state.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.

The SN74ALVCH16334 is characterized for operation from -40°C to 85°C.

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Documentación técnica

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Tipo Título Fecha
* Data sheet SN74ALVCH16334 datasheet (Rev. I) 26 ago 2004
Application note An Overview of Bus-Hold Circuit and the Applications (Rev. B) 17 sep 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
User guide ALVC Advanced Low-Voltage CMOS Including SSTL, HSTL, And ALB (Rev. B) 01 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 08 sep 1999
Application note TI SN74ALVC16835 Component Specification Analysis for PC100 03 ago 1998
Application note Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A) 13 may 1998
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 dic 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

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Modelo de simulación

SN74ALVCH16334 IBIS Model (Rev. A)

SCEM075A.ZIP (12 KB) - IBIS Model
Paquete Pasadores Descargar
SSOP (DL) 48 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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