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SN74AUC1G17

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Búfer único de alta velocidad de 0.8 V a 2.7 V con entradas de disparador Schmitt

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SN74AUC1G17

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Detalles del producto

Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 1 IOL (max) (mA) 9 Supply current (max) (µA) 10 IOH (max) (mA) -9 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
Technology family AUC Supply voltage (min) (V) 0.8 Supply voltage (max) (V) 2.7 Number of channels 1 IOL (max) (mA) 9 Supply current (max) (µA) 10 IOH (max) (mA) -9 Input type Schmitt-Trigger Output type Push-Pull Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns) Rating Catalog Operating temperature range (°C) -40 to 85
DSBGA (YZP) 5 2.1875 mm² 1.75 x 1.25 SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-5X3 (DRL) 5 2.56 mm² 1.6 x 1.6 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial Power Down Mode and Back Drive Protection
  • Sub 1-V Operable
  • Maximum tpd of 2.4 ns at 1.8 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in the Texas Instruments NanoFree™ Package
  • Optimized for 1.8-V Operation and Is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial Power Down Mode and Back Drive Protection
  • Sub 1-V Operable
  • Maximum tpd of 2.4 ns at 1.8 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±8-mA Output Drive at 1.8 V

This single Schmitt-trigger buffer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, see Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, SCEA027.

This single Schmitt-trigger buffer is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G17 contains one buffer and performs the Boolean function Y = A. The device functions as an independent buffer, but because of Schmitt action, it may have different input threshold levels for positive-going (VT+) and negative-going (VT–) signals.

NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

For more information about AUC Little Logic devices, see Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, SCEA027.
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Documentación técnica

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Tipo Título Fecha
* Data sheet SN74AUC1G17 Single Schmitt-Trigger Buffer datasheet (Rev. O) PDF | HTML 08 jun 2017
Application brief Understanding Schmitt Triggers (Rev. A) PDF | HTML 22 may 2019
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Designing With TI Ultra-Low-Voltage CMOS (AUC) Octals and Widebus Devices 21 mar 2003
User guide AUC Data Book, January 2003 (Rev. A) 01 ene 2003
Application note Texas Instruments Little Logic Application Report 01 nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 mar 2002
More literature AUC Product Brochure (Rev. A) 18 mar 2002

Diseño y desarrollo

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Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación lógica genérico para encapsulados DCK, DCT, DCU, DRL y DBV de 5 a 8 pines

Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
Guía del usuario: PDF
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Modelo de simulación

HSPICE Model of SN74AUC1G17

SCEJ133.ZIP (42 KB) - HSpice Model
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Modelo de simulación

SN74AUC1G17 Behavioral SPICE Model

SCEM722.ZIP (7 KB) - PSpice Model
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Modelo de simulación

SN74AUC1G17 IBIS Model (Rev. A)

SCEM227A.ZIP (54 KB) - IBIS Model
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Paquete Pasadores Descargar
DSBGA (YZP) 5 Ver opciones
SOT-23 (DBV) 5 Ver opciones
SOT-5X3 (DRL) 5 Ver opciones
SOT-SC70 (DCK) 5 Ver opciones
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Pedidos y calidad

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  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
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