SN74LVC1G07-Q1

ACTIVO

Búfer único de 1.65 V a 5.5 V, con salidas de drenaje abiertas de calidad automotriz

Detalles del producto

Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 1 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Automotive Operating temperature range (°C) -40 to 125
Technology family LVC Supply voltage (min) (V) 1.65 Supply voltage (max) (V) 5.5 Number of channels 1 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) 0 Input type Standard CMOS Output type Open-drain Features Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Automotive Operating temperature range (°C) -40 to 125
SOT-23 (DBV) 5 8.12 mm² 2.9 x 2.8 SOT-SC70 (DCK) 5 4.2 mm² 2 x 2.1 USON (DRY) 6 1.45 mm² 1.45 x 1
  • Qualified for automotive applications
  • AEC-Q100 Qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature
    • 2000-V Device human-body model (HBM) ESD classification level 2
    • 1000-V Device charged-device model (CDM) ESD classification level C5
  • Supports 5-V VCC operation
  • Input and open-drain output accept
    Voltages up to 5.5 V
  • Max tpd of 5.7 ns at 3.3 V
  • Low power consumption, 10-µA max ICC
  • ±24-mA Output drive at 3.3 V
  • Ioff Supports partial-power-down mode
    Operation
  • Qualified for automotive applications
  • AEC-Q100 Qualified with the following results:
    • Device temperature grade 1: –40°C to +125°C ambient operating temperature
    • 2000-V Device human-body model (HBM) ESD classification level 2
    • 1000-V Device charged-device model (CDM) ESD classification level C5
  • Supports 5-V VCC operation
  • Input and open-drain output accept
    Voltages up to 5.5 V
  • Max tpd of 5.7 ns at 3.3 V
  • Low power consumption, 10-µA max ICC
  • ±24-mA Output drive at 3.3 V
  • Ioff Supports partial-power-down mode
    Operation

The SN74LVC1G07-Q1 is a single channel open-drain buffer/driver qualified for automotive applications. This is designed for 1.65-V to 5.5-V VCC operation.

The output of the SN74LVC1G07-Q1 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The SN74LVC1G07-Q1 is a single channel open-drain buffer/driver qualified for automotive applications. This is designed for 1.65-V to 5.5-V VCC operation.

The output of the SN74LVC1G07-Q1 device is open drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.

This device is fully specified for partial-power-down applications using Ioff.The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

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Documentación técnica

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Tipo Título Fecha
* Data sheet SN74LVC1G07-Q1 Single Buffer/Driver With Open-Drain Output datasheet (Rev. B) PDF | HTML 22 oct 2019
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 jul 2021
Application brief Driving Indicator LEDs 15 oct 2020
Selection guide Little Logic Guide 2018 (Rev. G) 06 jul 2018
Selection guide Logic Guide (Rev. AB) 12 jun 2017
Application note How to Select Little Logic (Rev. A) 26 jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 dic 2015
More literature Automotive Logic Devices Brochure 27 ago 2014
User guide LOGIC Pocket Data Book (Rev. B) 16 ene 2007
Product overview Design Summary for WCSP Little Logic (Rev. B) 04 nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 jun 2004
User guide Signal Switch Data Book (Rev. A) 14 nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 nov 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 dic 2002
Application note Texas Instruments Little Logic Application Report 01 nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 ago 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 may 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 may 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 dic 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 ago 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 jun 1997
Application note LVC Characterization Information 01 dic 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 oct 1996
Application note Live Insertion 01 oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 may 1996

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

5-8-LOGIC-EVM — Módulo de evaluación lógica genérico para encapsulados DCK, DCT, DCU, DRL y DBV de 5 a 8 pines

Módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo que tenga un encapsulado DCK, DCT, DCU, DRL o DBV en un recuento de 5 a 8 pines.
Guía del usuario: PDF
Modelo de simulación

HSpice Model of SN74LVC1G07

SCAJ005.ZIP (38 KB) - HSpice Model
Modelo de simulación

SN74LVC1G07 Behavioral SPICE Model

SCAM106.ZIP (7 KB) - PSpice Model
Modelo de simulación

SN74LVC1G07 IBIS Model (Rev. E)

SCAM005E.ZIP (33 KB) - IBIS Model
Modelo de simulación

SN74LVC1G07 PSpice Model

SCEM571.ZIP (19 KB) - PSpice Model
Diseños de referencia

TIDA-00678 — Diseño de referencia de CISPR25 de luz trasera de calidad automotriz comprobada para sistemas basado

TIDA-00678 showcases an automotive LED tail light application (tail/stop, turn and reverse) by using TPS92630-Q1 linear LED driver powered by an upstream boost converter (TPS40210-Q1) which is directly supplied through a smart-reverse battery diode off the automotive battery voltage. The design (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-00679 — Diseño de referencia del controlador LED lineal para aplicaciones de iluminación de calidad automotr

TIDA-00679 an automotive LED tail-light application (tail/stop, turn and reverse). It uses TPS92630 linear LED driver which is directly powered through a smart-reverse battery diode off the automotive battery. The design enables potential cost savings and efficiency through lower power dissipation (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-00296 — Diseño de referencia del controlador del módulo de control de la carrocería de calidad automotriz

TIDA-00296 is a reference design that highlights TI's high-side and low-side relay, motor, and load driver portfolios. The loads for this design (door locks, window lifts, seat heaters, HVAC, lamps, and LEDs) were chosen to show the range of loads that a BCM can drive and how TI's solutions fit (...)
Test report: PDF
Esquema: PDF
Paquete Pasadores Descargar
SOT-23 (DBV) 5 Ver opciones
SOT-SC70 (DCK) 5 Ver opciones
USON (DRY) 6 Ver opciones

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

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