TXB0304

ACTIVO

Conversor de detección de dirección automática bidireccional de 4 bits con rango totalmente simétric

Detalles del producto

Technology family TXB Applications SPIO Bits (#) 4 Data rate (max) (Mbps) 140 High input voltage (min) (V) 0.81 High input voltage (max) (V) 3.6 Vout (min) (V) 0.9 Vout (max) (V) 3.6 IOH (max) (mA) -0.02 IOL (max) (mA) 0.02 Supply current (max) (µA) 10 Features Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State, CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
Technology family TXB Applications SPIO Bits (#) 4 Data rate (max) (Mbps) 140 High input voltage (min) (V) 0.81 High input voltage (max) (V) 3.6 Vout (min) (V) 0.9 Vout (max) (V) 3.6 IOH (max) (mA) -0.02 IOL (max) (mA) 0.02 Supply current (max) (µA) 10 Features Edge rate accelerator, Integrated pullup resistors, Output enable, Partial power down (Ioff), Vcc isolation Input type Standard CMOS Output type 3-State, CMOS, Push-Pull Rating Catalog Operating temperature range (°C) -40 to 85
UQFN (RSV) 16 4.68 mm² 2.6 x 1.8 UQFN (RUT) 12 3.4 mm² 2 x 1.7
  • Fully Symmetric Supply Voltages, 0.9 V to 3.6 V on A Port and 0.9 V to 3.6 V
  • VCC Isolation Feature – If Either VCC Input is at GND, all Outputs are in High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 5 µA Max (ICCA or ICCB)
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-B)
    • 1000-V Charged-Device Model (C101)
  • Fully Symmetric Supply Voltages, 0.9 V to 3.6 V on A Port and 0.9 V to 3.6 V
  • VCC Isolation Feature – If Either VCC Input is at GND, all Outputs are in High-Impedance State
  • OE Input Circuit Referenced to VCCA
  • Low Power Consumption, 5 µA Max (ICCA or ICCB)
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 8000-V Human-Body Model (A114-B)
    • 1000-V Charged-Device Model (C101)

This 4-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from
0.9 V to 3.6 V. This allows for low Voltage bidirectional translation between 1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V voltage nodes. For the TXB0304, when the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The OE device control pin input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The only difference between TXB0304 and TXBN0304 is the OE signal being active high and active low respectively.

This 4-bit non-inverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from
0.9 V to 3.6 V. This allows for low Voltage bidirectional translation between 1 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V voltage nodes. For the TXB0304, when the output-enable (OE) input is low, all outputs are placed in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pull-down resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. The OE device control pin input circuit is supplied by VCCA. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The only difference between TXB0304 and TXBN0304 is the OE signal being active high and active low respectively.

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Documentación técnica

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* Data sheet TXB0304 4-Bit Bidirectional Level-Shifter/Voltage Translator with Automatic Direction Sensing datasheet (Rev. G) PDF | HTML 29 abr 2019
Application note Leveraging Edge Rate Accelerators with Auto-Sensing Level Shifters PDF | HTML 29 sep 2023
Application note Do’s and Don’ts for TXB and TXS Voltage Level-Shifters with Edge Rate Accelerato PDF | HTML 28 jun 2023
Selection guide Voltage Translation Buying Guide (Rev. A) 15 abr 2021
Technical article How level shifters enable the transition to low-voltage processors in industrial e PDF | HTML 22 sep 2016
User guide TXB0304EVM 22 sep 2011

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Placa de evaluación

14-24-NL-LOGIC-EVM — Módulo de evaluación genérico de productos lógicos para encapsulados sin conductores de 14 a 24 pine

14-24-NL-LOGIC-EVM es un módulo de evaluación (EVM) flexible diseñado para admitir cualquier dispositivo lógico o de traducción que tenga un encapsulado BQA, BQB, RGY, RSV, RJW o RHL de 14 a 24 pines.

Guía del usuario: PDF | HTML
Placa de evaluación

TXB0304EVM — Módulo de evaluación TXB0304

The TXB0304 is a 4-bit voltage level translator for push-pull applications. The A port is designed to track VCCA. VCCA accepts any supply voltage from 0.9 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 0.9 V to 3.6 V. This allows for low-voltage (...)

Guía del usuario: PDF
Modelo de simulación

TXB0304 IBIS Model (Rev. A)

SCEM544A.ZIP (69 KB) - IBIS Model
Paquete Pasadores Descargar
UQFN (RSV) 16 Ver opciones
UQFN (RUT) 12 Ver opciones

Pedidos y calidad

Información incluida:
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  • REACH
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  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
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  • Lugar de fabricación
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