This four-diode array is designed for general purpose use as individual diodes or as a high-speed, high-current bridge. It is particularly useful on the outputs of high-speed power MOSFET drivers where Schottky diodes are needed to clamp any negative excursions caused by ringing on the driven line.These diodes are also ideally suited for use as voltage clamps when driving inductive loads such as relays and solenoids, and to provide a path for current free-wheeling in motor drive applications.The use of Schottky diode technology features high efficiency through lowered forward voltage drop and decreased reverse recovery time.This single monolithic chip is fabricated in both hermetic CERDIP and copper-eaded plastic packages. The UC1611 in ceramic is designed for -55°C to 125°C environments but with reduced peak current capability: while the UC3611 in plastic has higher current rating over a 0°C to 70°C ambient temperature range.
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | Quad Schottky Diode Array datasheet (Rev. A) | 15 may 2001 | |
| * | SMD | UC1611-SP SMD 5962-90538 | 08 jul 2016 | |
| More literature | TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) | 31 ago 2023 | ||
| Application note | Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) | PDF | HTML | 17 nov 2022 | |
| Application note | Single-Event Effects Confidence Interval Calculations (Rev. A) | PDF | HTML | 19 oct 2022 | |
| Application note | ESD Packaging and Layout Guide (Rev. B) | PDF | HTML | 18 ago 2022 | |
| Selection guide | TI Space Products (Rev. I) | 03 mar 2022 | ||
| User guide | Generic ESD Evaluation Module User's Guide (Rev. A) | PDF | HTML | 27 sep 2021 | |
| Application note | DLA Standard Microcircuit Drawings (SMD) and JAN Part Numbers Primer | 21 ago 2020 | ||
| Application note | Hermetic Package Reflow Profiles, Termination Finishes, and Lead Trim and Form | PDF | HTML | 18 may 2020 | |
| E-book | Radiation Handbook for Electronics (Rev. A) | 21 may 2019 |
Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.
<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
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| Paquete | Pasadores | Descargar |
|---|---|---|
| CDIP (JG) | 8 | Ver opciones |
| LCCC (FK) | 20 | Ver opciones |
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