제품 상세 정보

Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2400 Features Ultra High Speed Rating Space Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 58.2 ENOB (bit) 9.3 SFDR (dB) 67.3 Operating temperature range (°C) -55 to 125 Input buffer Yes Radiation, TID (typ) (krad) 300 Radiation, SEL (MeV·cm2/mg) 120
Sample rate (max) (Msps) 1600, 3200 Resolution (Bits) 12 Number of input channels 1, 2 Interface type Parallel LVDS Analog input BW (MHz) 2400 Features Ultra High Speed Rating Space Peak-to-peak input voltage range (V) 0.8 Power consumption (typ) (mW) 3880 Architecture Folding Interpolating SNR (dB) 58.2 ENOB (bit) 9.3 SFDR (dB) 67.3 Operating temperature range (°C) -55 to 125 Input buffer Yes Radiation, TID (typ) (krad) 300 Radiation, SEL (MeV·cm2/mg) 120
CCGA (NAA) 376 780.6436 mm² 27.94 x 27.94
  • Total Ionizing Dose (TID) to 300 krad(Si)
  • Single Event Latch-up (SEL) > 120 MeV-cm2/mg
  • Wide Temperature Range –55°C to +125°C
  • Low Power Consumption
  • R/W SPI for Extended Control Mode or Simple Pin Control Mode
  • Interleaved Timing Automatic with Manual Skew Adjust
  • Auto-Sync Function for Multi-Chip Systems
  • Time Stamp Feature to Capture External Trigger
  • Test Patterns at Output for System Debug
  • 1:1 Non-Demuxed or 1:2 or 1:4 Parallel Demuxed LVDS Outputs
  • Single 1.9V Power Supply
  • 376 CPGA Hermetic Package
  • Total Ionizing Dose (TID) to 300 krad(Si)
  • Single Event Latch-up (SEL) > 120 MeV-cm2/mg
  • Wide Temperature Range –55°C to +125°C
  • Low Power Consumption
  • R/W SPI for Extended Control Mode or Simple Pin Control Mode
  • Interleaved Timing Automatic with Manual Skew Adjust
  • Auto-Sync Function for Multi-Chip Systems
  • Time Stamp Feature to Capture External Trigger
  • Test Patterns at Output for System Debug
  • 1:1 Non-Demuxed or 1:2 or 1:4 Parallel Demuxed LVDS Outputs
  • Single 1.9V Power Supply
  • 376 CPGA Hermetic Package

The ADC12D1600QML is a low power, high performance CMOS analog-to-digital converter that digitizes signals at a 12-bit resolution at sampling rates up to 3.2 GSPS in an interleaved mode. It can also be used as a dual channel ADC for sampling rates up to 1.6 GSPS. For sampling rates below 800 MHz, there is a Low Sampling Power Saving Mode (LSPSM) that reduces power consumption to less than 1.4 W per channel (typical). The ADC can support conversion rates as low as 200 MSPS.

The ADC1600QML provides a flexible parallel LVDS interface which has multiple SPI programmable options to facilitate board design and ASIC/FPGA data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common mode voltage. The output of each channel is configurable in either 1:1 non-demuxed or 1:2 demuxed modes. If used as a single channel ADC, there is an option for 1:4 demuxing of the output. The product comes in a hermetic 376 CPGA package for harsh environments.

The ADC12D1600QML is a low power, high performance CMOS analog-to-digital converter that digitizes signals at a 12-bit resolution at sampling rates up to 3.2 GSPS in an interleaved mode. It can also be used as a dual channel ADC for sampling rates up to 1.6 GSPS. For sampling rates below 800 MHz, there is a Low Sampling Power Saving Mode (LSPSM) that reduces power consumption to less than 1.4 W per channel (typical). The ADC can support conversion rates as low as 200 MSPS.

The ADC1600QML provides a flexible parallel LVDS interface which has multiple SPI programmable options to facilitate board design and ASIC/FPGA data capture. The LVDS outputs are compatible with IEEE 1596.3-1996 and support programmable common mode voltage. The output of each channel is configurable in either 1:1 non-demuxed or 1:2 demuxed modes. If used as a single channel ADC, there is an option for 1:4 demuxing of the output. The product comes in a hermetic 376 CPGA package for harsh environments.

다운로드 스크립트와 함께 비디오 보기 동영상

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기16
유형 직함 날짜
* Data sheet ADC12D1600QML 12-Bit, 3.2/2.0 GSPS RF Sampling ADC datasheet 2012/12/17
* Radiation & reliability report ADC12D1600QML-SP/ADC12D1620QML-SP Single-Event Effects (SEE) Radiation Report 2020/07/27
* Radiation & reliability report ADC12D1600CCMLS TID Report 2013/01/17
* Radiation & reliability report Analysis of Low Dose Rate Effects on Parasitic Bipolar Structures in CMOS Proces 2012/05/04
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 2023/08/31
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) PDF | HTML 2022/11/17
Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML 2022/10/19
Selection guide TI Space Products (Rev. I) 2022/03/03
Application brief Understanding Op Amp Noise in Audio Circuits PDF | HTML 2021/06/14
Application note AN-2132 Synchronizing Multiple GSPS ADCs in a System: The AutoSync Feature (Rev. G) 2017/02/03
Application note Wide Bandwidth Receiver Implementation by Interleaving Two Giga-Sampling ADCs 2015/12/07
Application note Signal Chain Noise Figure Analysis 2014/10/29
Application note Synchronizing the Giga-Sample ADCs Interfaced with Multiple FPGAs 2014/08/06
Application note AN-2128 ADC1xD1x00 Pin Compatibility (Rev. C) 2013/05/01
Application note From Sample Instant to Data Output: Understanding Latency in the GSPS ADC 2012/12/18
Product overview ADC12Dxx00RF Direct RF-Sampling ADC Family 2012/05/16

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

시뮬레이션 모델

ADC12D1600 IBIS Model (Rev. A)

SNAM125A.ZIP (43 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
패키지 다운로드
CCGA (NAA) 376 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상