DS90C383B
- No special start-up sequence required between clock/data and /PD pins. Input signal (clock and data) can be applied either before or after the device is powered
- Support Spread Spectrum Clocking up to 100kHz frequency modulation and deviations of ±2.5% center spread or -5% down spread
- "Input Clock Detection" feature will pull all LVDS pairs to logic low when input clock is missing and when /PD pin is logic high
- 18 to 68 MHz shift clock support
- Best-in-Class Setup and Hold Times on TxINPUTs
- Tx power consumption < 130 mW (typ) at 65MHz Grayscale
- 40% Less Power Dissipation than BiCMOS Alternatives
- Tx Power-down mode < 60μW (typ)
- Supports VGA, SVGA, XGA and Dual Pixel SXGA.
- Narrow bus reduces cable size and cost
- Up to 1.8 Gbps throughput
- Up to 227 Megabytes/sec bandwidth
- 345 mV (typ) swing LVDS devices for low EMI
- PLL requires no external components
- Compatible with TIA/EIA-644 LVDS standard
- Low profile 56-lead TSSOP package
- Improved replacement for:
- SN75LVDS83, DS90C383A
All trademarks are the property of their respective owners. TRI-STATE is a trademark of Texas Instruments. TRI-STATE is a trademark of Texas Instruments.
The DS90C383B transmitter converts 28 bits of CMOS/TTL data into four LVDS (Low Voltage Differential Signaling) data streams. A phase-locked transmit clock is transmitted in parallel with the data streams over a fifth LVDS link. Every cycle of the transmit clock 28 bits of input data are sampled and transmitted. At a transmit clock frequency of 65 MHz, 24 bits of RGB data and 3 bits of LCD timing and control data (FPLINE, FPFRAME, DRDY) are transmitted at a rate of 455 Mbps per LVDS data channel. Using a 65 MHz clock, the data throughput is 227 Mbytes/sec. The DS90C383B transmitter can be programmed for Rising edge strobe or Falling edge strobe through a dedicated pin. A Rising edge or Falling edge strobe transmitter will interoperate with a Falling edge strobe Receiver (DS90CF386) without any translation logic.
This chipset is an ideal means to solve EMI and cable size problems associated with wide, high speed TTL interfaces.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | DS90C383B 3.3V Prog LVDS Trans 24-Bit FPD Link-65 MHz datasheet (Rev. G) | 2013/04/17 | |
| Application note | High-Speed Layout Guidelines for Reducing EMI for LVDS SerDes Designs | 2018/11/09 | ||
| Application note | How to Map RGB Signals to LVDS/OpenLDI(OLDI) Displays (Rev. A) | 2018/06/29 | ||
| Application note | AN-1032 An Introduction to FPD-Link (Rev. C) | 2017/08/08 | ||
| Application note | Receiver Skew Margin for Channel Link I and FPD Link I Devices | 2016/01/13 | ||
| Application note | TFT Data Mapping for Dual Pixel LDI Application - Alternate A - Color Map | 2004/05/15 | ||
| Application note | AN-1056 STN Application Using FPD-Link | 2004/05/14 | ||
| Application note | AN-1085 FPD-Link PCB and Interconnect Design-In Guidelines | 2004/05/14 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
TIDA-01051 — 자동 테스트 장비에 대한 FPGA 활용률 및 데이터 처리량 최적화 레퍼런스 디자인
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| TSSOP (DGG) | 56 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.