인터페이스 다이오드 ESD 보호 다이오드

ESD122

활성

USB Type-C 및 HDMI 2.0용 듀얼 0.2pF, ±3.6V, ±17kV ESD 보호 다이오드

제품 상세 정보

Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 20 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 0.2 Clamping voltage (V) 13.5 Breakdown voltage (min) (V) 5
Package name DFN-1006 (X1SON) Peak pulse power (8/20 μs) (max) (W) 20 Vrwm (V) 3.6 Bi-/uni-directional Bi-directional Number of channels 2 IO capacitance (typ) (pF) 0.2 Clamping voltage (V) 13.5 Breakdown voltage (min) (V) 5
X2SON (DMX) 3 0.6 mm² 1 x 0.6 X2SON (DMY) 3 0.78 mm² 1.3 x 0.6
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

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기술 문서

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모두 보기11
유형 직함 날짜
* Data sheet ESD122 2-Channel ESD Protection Diode for USB Type-C and HDMI 2.0 datasheet (Rev. A) PDF | HTML 2018/08/13
Application note ESD and Surge Protection for USB Interfaces (Rev. B) PDF | HTML 2024/01/11
Application brief ESD Protection for HDMI Applications (Rev. A) PDF | HTML 2023/11/01
Application note Capacitance Requirements for High Speed Signals (Rev. A) PDF | HTML 2023/08/21
Selection guide System-Level ESD Protection Guide (Rev. D) 2022/09/07
Application note ESD Packaging and Layout Guide (Rev. B) PDF | HTML 2022/08/18
User guide Generic ESD Evaluation Module User's Guide (Rev. A) PDF | HTML 2021/09/27
Technical article ESD fundamentals, part 4: ESD capacitance PDF | HTML 2018/02/12
Technical article ESD fundamentals, part 3: clamping voltage PDF | HTML 2017/12/06
Application note ESD224 HDMI 2.0 Compliance and Protection 2017/11/30
Technical article Big USB Type-C™ protection for your small application PDF | HTML 2017/07/31

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

평가 보드

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<p>The electrostatic-sensitive device (ESD) evaluation module (EVM) is a development platform for most of our ESD portfolio. The board comes with all traditional ESD footprints in order to test any number of devices. Devices can be soldered onto their respect footprint and then tested.</p>
(...)

사용 설명서: PDF | HTML
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시뮬레이션 모델

ESD122 IBIS Model

SLVMC36.ZIP (2 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
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사용 설명서: PDF
레퍼런스 디자인

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회로도: PDF
레퍼런스 디자인

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Design guide: PDF
회로도: PDF
패키지 다운로드
X2SON (DMX) 3 옵션 보기
X2SON (DMY) 3 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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