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ISO7831

활성

최고 절연 등급, 트리플 채널, 2/1, 강화 디지털 아이솔레이터

지금 주문
데이터시트

ISO7831

활성
데이터시트 지금 주문

제품 상세 정보

Rating Catalog Integrated isolated power No Isolation rating Reinforced Number of channels 3 Forward/reverse channels 2 forward / 1 reverse Default output High, Low Data rate (max) (Mbps) 100 Surge isolation voltage (VIOSM) (VPK) 12800 Transient isolation voltage (VIOTM) (VPK) 8000 Withstand isolation voltage (VISO) (Vrms) 5700 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -55 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107 Current consumption per channel (DC) (typ) (mA) 1.03 Current consumption per channel (1 Mbps) (typ) (mA) 1.67 Creepage (min) (mm) 8, 14.5 Clearance (min) (mm) 8, 14.5
Rating Catalog Integrated isolated power No Isolation rating Reinforced Number of channels 3 Forward/reverse channels 2 forward / 1 reverse Default output High, Low Data rate (max) (Mbps) 100 Surge isolation voltage (VIOSM) (VPK) 12800 Transient isolation voltage (VIOTM) (VPK) 8000 Withstand isolation voltage (VISO) (Vrms) 5700 CMTI (min) (V/µs) 85000 Operating temperature range (°C) -55 to 125 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 2.25 Propagation delay time (typ) (µs) 0.0107 Current consumption per channel (DC) (typ) (mA) 1.03 Current consumption per channel (1 Mbps) (typ) (mA) 1.67 Creepage (min) (mm) 8, 14.5 Clearance (min) (mm) 8, 14.5
SOIC (DW) 16 106.09 mm² 10.3 x 10.3 SOIC (DWW) 16 177.675 mm² 10.3 x 17.25
  • Signaling Rate: Up to 100 Mbps
  • Wide Supply Range: 2.25 V to 5.5 V
  • 2.25 V to 5.5 V Level Translation
  • Wide Temperature Range: –55°C to 125°C
  • Low Power Consumption, Typical 1.7 mA per
    Channel at 1 Mbps
  • Low Propagation Delay: 11 ns Typical
    (5-V Supplies)
  • Industry leading CMTI (min): ±100 kV/µs
  • Robust Electromagnetic Compatibility (EMC)
  • System-Level ESD, EFT, and Surge Immunity
  • Low Emissions
  • Isolation Barrier Life: > 40 Years
  • SOIC-16 Wide Body (DW) and Extra-Wide Body
    (DWW) Package Options
  • Safety-Related Certifications:
    • 8000 VPK Reinforced Isolation per DIN V VDE
      V 0884-10 (VDE V 0884-10):2006-12
    • 5.7 kVRMS Isolation for 1 Minute per UL 1577
    • CSA Component Acceptance Notice 5A, IEC
      60950-1 and IEC 60601-1 End Equipment
      Standards
    • CQC Certification per GB4943.1-2011
    • TUV Certification per EN 61010-1 and EN
      60950-1
    • All DW Package Certifications Complete;
      DWW Package Certifications Complete per
      UL, VDE, TUV and Planned for CSA and CQC
  • Signaling Rate: Up to 100 Mbps
  • Wide Supply Range: 2.25 V to 5.5 V
  • 2.25 V to 5.5 V Level Translation
  • Wide Temperature Range: –55°C to 125°C
  • Low Power Consumption, Typical 1.7 mA per
    Channel at 1 Mbps
  • Low Propagation Delay: 11 ns Typical
    (5-V Supplies)
  • Industry leading CMTI (min): ±100 kV/µs
  • Robust Electromagnetic Compatibility (EMC)
  • System-Level ESD, EFT, and Surge Immunity
  • Low Emissions
  • Isolation Barrier Life: > 40 Years
  • SOIC-16 Wide Body (DW) and Extra-Wide Body
    (DWW) Package Options
  • Safety-Related Certifications:
    • 8000 VPK Reinforced Isolation per DIN V VDE
      V 0884-10 (VDE V 0884-10):2006-12
    • 5.7 kVRMS Isolation for 1 Minute per UL 1577
    • CSA Component Acceptance Notice 5A, IEC
      60950-1 and IEC 60601-1 End Equipment
      Standards
    • CQC Certification per GB4943.1-2011
    • TUV Certification per EN 61010-1 and EN
      60950-1
    • All DW Package Certifications Complete;
      DWW Package Certifications Complete per
      UL, VDE, TUV and Planned for CSA and CQC

The ISO7831x device is a high-performance, 3-channel digital isolator with 8000-VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, TUV and CQC. The isolator provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os.

Each isolation channel has a logic input and output buffer separated by silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7831x device has two forward and one reverse-direction channels. If the input power or signal is lost, the default output is high for the ISO7831 device and low for the ISO7831F device. See Device Functional Modes for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of ISO7831x has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. ISO7831x is available in a 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages.

The ISO7831x device is a high-performance, 3-channel digital isolator with 8000-VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, TUV and CQC. The isolator provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os.

Each isolation channel has a logic input and output buffer separated by silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7831x device has two forward and one reverse-direction channels. If the input power or signal is lost, the default output is high for the ISO7831 device and low for the ISO7831F device. See Device Functional Modes for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of ISO7831x has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. ISO7831x is available in a 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages.
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기술 문서

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모두 보기25
유형 직함 날짜
* Data sheet ISO7831x High-Performance, 8000-VPK Reinforced Triple Digital Isolators datasheet (Rev. B) PDF | HTML 2016/06/28
Certificate VDE Certificate for Reinforced Isolation for DIN EN IEC 60747-17 (Rev. S) 2024/02/29
Application note Digital Isolator Design Guide (Rev. G) PDF | HTML 2023/09/13
White paper Improve Your System Performance by Replacing Optocouplers with Digital Isolators (Rev. C) PDF | HTML 2023/09/07
White paper Circuit Board Insulation Design According to IEC60664 for Motor Drive Apps PDF | HTML 2023/08/31
Certificate CQC Certificate for ISOxxDWx (Rev. J) 2023/03/27
Certificate CSA Certificate for ISO78xxDWx 2023/03/13
Certificate TUV Certificate for Isolation Devices (Rev. K) 2022/08/05
Certificate UL Certificate of Compliance File E181974 Vol 4 Sec 6 (Rev. P) 2022/08/05
White paper Why are Digital Isolators Certified to Meet Electrical Equipment Standards? 2021/11/16
White paper Distance Through Insulation: How Digital Isolators Meet Certification Requiremen PDF | HTML 2021/06/11
EVM User's guide Universal Digital Isolator Evaluation Module PDF | HTML 2021/03/04
Functional safety information Isolation in AC Motor Drives: Understanding the IEC 61800-5-1 Safety Standard (Rev. A) 2019/09/19
White paper Direct-drive configuration for GaN devices (Rev. A) 2018/11/19
Analog Design Journal Pushing the envelope with high-performance digital-isolation technology (Rev. A) 2018/08/22
Application brief Considerations for Selecting Digital Isolators 2018/07/24
Functional safety information Isolation in solar power converters: Understanding the IEC62109-1 safety standar (Rev. A) 2018/05/18
Analog Design Journal How to reduce radiated emissions of digital isolators for systems with RF module 2018/03/26
Application note Isolation Glossary (Rev. A) 2017/09/19
Technical article Is integrated GaN changing the conventional wisdom? PDF | HTML 2016/10/07
Analog Design Journal 4Q 2015 Analog Applications Journal 2015/10/30
Analog Design Journal Pushing the envelope with high-performance digital-isolation technology 2015/10/30
EVM User's guide ISO784xx Quad-Channel Digital Isolator EVM User Guide 2014/10/17
White paper Understanding electromagnetic compliance tests in digital isolators 2014/10/17
White paper High-voltage reinforced isolation: Definitions and test methodologies 2014/10/16

설계 및 개발

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평가 보드

DIGI-ISO-EVM — 범용 디지털 아이솔레이터 평가 모듈

DIGI-ISO-EVM은 5가지 패키지(8핀 네로우 바디 SOIC(D), 8핀 와이드 바디 SOIC(DWV), 16핀 와이드 바디 SOIC(DW), 16핀 울트라 와이드 바디 SOIC(DWW), 16핀 QSOP(DBQ) 패키지)에서 TI 싱글 채널, 듀얼 채널, 트리플 채널, 쿼드 채널 또는 6채널 디지털 절연기 장치를 평가하는 데 사용되는 평가 모듈(EVM)입니다. EVM에는 최소한의 외부 구성품으로 장치를 평가할 수 있는 충분한 Berg 핀 옵션이 있습니다.

사용 설명서: PDF | HTML
TI.com에서 구매할 수 없습니다
평가 보드

ISO7842-EVM — 높은 내성, 5.7kVRMS의 강화 쿼드-채널 2/2 디지털 아이솔레이터, 평가 모듈

The ISO7842 provides galvanic isolation up to 5700 VRMS for 1 minute per UL and 8000 VPK per VDE. This device has four isolated channels comprised of a logic input and output buffer separated by a silicon dioxide (SiO2) insulation barrier. Used in conjunction with isolated power supplies, this (...)

사용 설명서: PDF
TI.com에서 구매할 수 없습니다
도터 카드

LMG3410-HB-EVM — LMG3410R070 600V 70-mΩ GaN 하프 브리지 부속 카드

The LMG34XX-BB-EVM is an easy to use breakout board to configure any LMG34XX half bridge board, such as the LMG3410-HB-EVM, as a synchronous buck converter.  By providing a power stage, bias power and logic circuitry this EVM allows for quick measurements of the GaN device switching. (...)
사용 설명서: PDF
TI.com에서 구매할 수 없습니다
시뮬레이션 모델

ISO7831 IBIS Model (Rev. B)

SLLM286B.ZIP (104 KB) - IBIS Model
다운로드
시뮬레이션 모델

ISO7831F IBIS Model

SLLM288.IBS (243 KB) - IBIS Model
다운로드
레퍼런스 디자인

PMP20873 — 99% 효율 1kW GaN 기반 CCM 토템 폴 PFC(역률 보정) 컨버터 레퍼런스 디자인

Continuous-Conduction-Mode (CCM) Totem-pole power factor correction (PFC) is a simple but efficient power converter.  To achieve 99% efficiency, there are many design details that need to be taken into account.  The PMP20873 reference design uses TI’s 600VGaN  power stage, (...)
Test report: PDF
회로도: PDF
레퍼런스 디자인

TIDM-1007 — 고효율 GaN CCM 토템 폴 브리지리스 PFC(역률 보정) 레퍼런스 디자인

Interleaved Continuous Conduction Mode (CCM) Totem Pole (TTPL) Bridgeless Power Factor Correction (PFC) is an attractive power topology with use of high band-gap GaN devices, because of high efficiency and reduced size of the power supply. This design illustrates a method to control this power (...)
Design guide: PDF
회로도: PDF
레퍼런스 디자인

TIDM-02008 — C2000™ MCU를 사용하는 양방향 고밀도 GaN CCM 토템 폴 PFC 레퍼런스 설계

This reference design is a 3.-kW bidirectional interleaved continuous conduction mode (CCM) totem-pole (TTPL) bridgeless power factor correction (PFC) power stage using a C2000™ real-time controller and LMG3410R070 gallium nitride (GaN) with integrated driver and protection. (...)
Design guide: PDF
회로도: PDF
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SOIC (DWW) 16 옵션 보기
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