LM4859
- Stereo Speaker Amplifier
- Stereo Headphone Amplifier
- Independent Left, Right, and Mono Volume Controls
- Texas Instruments 3D Enhancement
- I2C Compatible Interface
- Ultra Low Shutdown Current
- Click and Pop Suppression Circuit
- 10 Distinct Output Modes
- Thermal Shutdown Protection
- Available in DSBGA and UQFN packages
Key Specifications
- POUT, Stereo Loudspeakers, 4Ω, 5V,
1% THD+N (LM4859SP), 1.6W (Typ) - POUT, Stereo Loudspeakers, 8Ω, 5V,
1% THD+N, 1.2W (Typ) - POUT, Stereo Headphones, 32Ω, 5V,
1% THD+N, 75mW (typ) - POUT, Stereo Loudspeakers, 8Ω, 3.3V,
1% THD+N, 495mW (typ) - POUT, Stereo Headphones, 32Ω, 3.3V,
1% THD+N, 33mW (typ) - Shutdown Current, 0.06μA (typ)
All trademarks are the property of their respective owners.
The LM4859 is an integrated audio sub-system designed for stereo cell phone applications. Operating on a 3.3V supply, it combines a stereo speaker amplifier delivering 495mW per channel into an 8Ω load and a stereo headphone amplifier delivering 33mW per channel into a 32Ω load. It integrates the audio amplifiers, volume control, mixer, power management control, and Texas Instruments 3D enhancement all into a single package. In addition, the LM4859 routes and mixes the stereo and mono inputs into 10 distinct output modes. The LM4859 is controlled through an I2C compatible interface. Other features include an ultra-low current shutdown mode and thermal shutdown protection.
Boomer audio power amplifiers are designed specifically to provide high quality output power with a minimal amount of external components.
The LM4859 is available in a 30–bump TL package and a 28–lead UQFN package.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | LM4859 Stereo 1.2W Audio Sub-system with 3D Enhancement datasheet (Rev. E) | 2013/05/02 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
패키지 | 핀 | 다운로드 |
---|---|---|
UQFN (NJD) | 28 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치