ONET8501V
- Up to 11.3 Gbps Operation
- 2-Wire Digital Interface
- Digitally Selectable Modulation Current up to 24 mApp Differential
- Digitally Selectable Bias Current up to 20 mA
- Automatic Power Control (APC) Loop
- Supports Transceiver Management System (TMS)
- Programmable Input Equalizer
- Output Waveform Control
- Includes Laser Safety Features
- Analog Temperature Sensor Output
- Selectable Monitor Photodiode Current Range
- Output Polarity Select
- Single 3.3V Supply
- Operating Temperature -40°C to 85°C
- Surface Mount Small Footprint 4mm × 4mm 20 Pin RoHS compliant QFN Package
- APPLICATIONS
- 10 Gigabit Ethernet Optical Transmitters
- 8x and 10x Fibre Channel Optical Transmitters
- SONET OC-192/SDH STM-64 Optical Transmitters
- SFP+ and XFP Transceiver Modules
- XENPAK, XPAK, X2 and 300-pin MSA Transponder Modules
The ONET8501V is a high-speed, 3.3V laser driver designed to directly modulate VCSELs at data rates from 2 Gbps up to 11.3 Gbps.
The device provides a two-wire serial interface which allows digital control of the modulation and bias currents, eliminating the need for external components. Output waveform control, in the form of cross point control and independent over- and undershoot capability on the rising and falling edges is also available to improve VCSEL edge speeds and the optical eye diagram. An optional input equalizer can be used for equalization of up to 300mm (12 inch) of microstrip or stripline transmission line on FR4 printed circuit boards.
The ONET8501V includes an integrated automatic power control (APC) loop as well as circuitry to support laser safety and transceiver management systems. The VCSEL driver is characterized for operation from -40°C to 85°C ambient temperatures and is available in a small footprint 4mm × 4mm 20 pin RoHS compliant QFN package.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 11.3 Gbps Differential VCSEL Driver w/Output Waveform Shaping datasheet (Rev. B) | 2007/08/20 | |
| Application note | Considerations for PCB Layout and Impedance Matching Design in Optical Modules | 2011/02/15 |
설계 및 개발
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| 패키지 | 핀 | 다운로드 |
|---|---|---|
| VQFN (RGP) | 20 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
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