PGA280
- Wide input range: ±15.5 V at ±18-V supply
- Binary gain steps: 128V/V to 1/8 V/V
- Additional scaling factor: 1 V/V and 1⅜ V/V
- Low offset voltage: 3 µV at G = 128
- Near-zero long-term drift of offset voltage
- Near-zero gain drift: 0.5 ppm/°C
- Excellent linearity: 1.5 ppm
- Excellent CMRR: 140 dB
- High input impedance
- Very low 1/f noise
- Differential signal output
- Overload detection
- Input configuration switch matrix
- Wire break test current
- Expandable SPI™ with checksum
- General-purpose I/O port
- TSSOP-24 package
The PGA280 is a high-precision instrumentation amplifier with digitally-controllable gain and signal integrity test capability. This device offers low offset voltage, near-zero offset and gain drift, excellent linearity, and nearly no 1/f noise with superior common-mode and supply rejection to support high-resolution precision measurement. The 36-V supply capability and wide, high-impedance input range comply with requirements for universal signal measurement.
Special circuitry prevents inrush currents from multiplexer (MUX) switching. In addition, the input switch matrix enables easy reconfiguration and system-level diagnostics—overload conditions are indicated.
The configurable general-purpose input/output (GPIO) offers several control and communication features. The SPI can be expanded to communicate with more devices, supporting isolation with only four ISO couplers. The PGA280 is available in a TSSOP-24 package and is specified from –40°C to +105°C. For all available packages, see the package option addendum at the end of the data sheet.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | PGA280 Zerø-Drift, High-Voltage, Programmable Gain Instrumentation Amplifier datasheet (Rev. B) | PDF | HTML | 2020/04/08 |
| Analog Design Journal | Precision signal conditioning for safety-enabled AIMs in factory automation | 2019/09/30 | ||
| EVM User's guide | ADS1259EVM and ADS1259EVM-PDK User's Guide (Rev. B) | 2016/05/14 | ||
| Application note | PGA280 Communication via SPI™ | 2009/12/06 |
설계 및 개발
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| 패키지 | 핀 | 다운로드 |
|---|---|---|
| TSSOP (PW) | 24 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치