홈 스위치 및 멀티플렉서 디지탈 디멀티플렉서 및 디코더
홈
스위치 및 멀티플렉서
디지탈 디멀티플렉서 및 디코더

SN54HC138-SP

활성

3라인-8라인 디코더/디멀티플렉서

지금 주문
데이터시트

SN54HC138-SP

활성
데이터시트 지금 주문

제품 상세 정보

Technology family HC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Space Supply current (max) (µA) 160
Technology family HC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Space Supply current (max) (µA) 160
CDIP (J) 16 135.3552 mm² 19.56 x 6.92 CFP (W) 16 69.319 mm² 10.3 x 6.73
  • Targeted Specifically for High-Speed Memory Decoders and Data-Transmission Systems
  • Wide Operating Voltage Range (2 V to 6 V)
  • Outputs Can Drive Up To 10 LSTTL Loads
  • Low Power Consumption, 80-µA Maximum ICC
  • Typical tpd = 15 ns
  • ±4-mA Output Drive at 5 V
  • Low Input Current of 1-µA Maximum
  • Active Low Outputs ( Selected Output is Low)
  • Incorporate Three Enable Inputs to Simplify Cascading or Data Reception
  • Targeted Specifically for High-Speed Memory Decoders and Data-Transmission Systems
  • Wide Operating Voltage Range (2 V to 6 V)
  • Outputs Can Drive Up To 10 LSTTL Loads
  • Low Power Consumption, 80-µA Maximum ICC
  • Typical tpd = 15 ns
  • ±4-mA Output Drive at 5 V
  • Low Input Current of 1-µA Maximum
  • Active Low Outputs ( Selected Output is Low)
  • Incorporate Three Enable Inputs to Simplify Cascading or Data Reception

The SNx4HC138 devices are designed to be used in high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories using a fast enable circuit, the delay times of these decoders and the enable time of the memory are usually less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible.

The SNx4HC138 devices are designed to be used in high-performance memory-decoding or data-routing applications requiring very short propagation delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories using a fast enable circuit, the delay times of these decoders and the enable time of the memory are usually less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible.
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기술 문서

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모두 보기19
유형 직함 날짜
* Data sheet SNx4HC138 3-Line To 8-Line Decoders/Demultiplexers datasheet (Rev. G) PDF | HTML 2021/10/08
* SMD SN54HC138-SP SMD 5962-84062 2016/07/08
More literature TI Engineering Evaluation Units vs. MIL-PRF-38535 QML Class V Processing (Rev. A) 2023/08/31
Application note Heavy Ion Orbital Environment Single-Event Effects Estimations (Rev. A) PDF | HTML 2022/11/17
Application note Single-Event Effects Confidence Interval Calculations (Rev. A) PDF | HTML 2022/10/19
Selection guide TI Space Products (Rev. I) 2022/03/03
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
User guide Signal Switch Data Book (Rev. A) 2003/11/14
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Designing With Logic (Rev. C) 1997/06/01
Application note Input and Output Characteristics of Digital Integrated Circuits 1996/10/01
Application note Live Insertion 1996/10/01
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 1996/05/01
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996/04/01

설계 및 개발

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패키지 핀 다운로드
CDIP (J) 16 옵션 보기
CFP (W) 16 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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