SN65LVCP23
- High Speed 2x2 LVPECL Crosspoint Switch
- LVDS Crosspoint Switch Available in SN65LVCP22
- 50 ps (Typ), of Peak-to-Peak Jitter With PRBS = 223- 1 Pattern
- Output (Channel-to-Channel) Skew Is 10 ps (Typ), 50 ps (Max)
- Configurable as 2:1 Mux, 1:2 Demux, Repeater or 1:2 Signal Splitter
- Inputs Accept LVDS, LVPECL, and CML Signals
- Fast Switch Time of 1.7 ns (Typ)
- Fast Propagation Delay of 0.75 ns (Typ)
- 16 Lead SOIC and TSSOP Packages
- Operating Temperature: -40°C to 85°C
- APPLICATIONS
- Gigabit Ethernet Redundant Transmission Paths
- Gigabit Interface Converters (GBICs)
- Fibre Channel Redundant Transmission Paths
- HDTV Video Routing
- Base Stations
- Protection Switching for Serial Backplanes
- Network Switches/Routers
- Optical Networking Line Cards/Switches
- Clock Distribution
The SN65LVCP23 is a 2x2 LVPECL crosspoint switch. The dual channels incorporate wide common-mode (0 V to 4 V) receivers, allowing for the receipt of LVDS, LVPECL, and CML signals. The dual outputs are LVPECL drivers to provide high-speed operation. The SN65LVCP23 provides a single device supporting 2:2 buffering (repeating), 1:2 splitting, 2:1 multiplexing, 2x2 switching, and LVDS/CML to LVPECL level translation on each channel. The flexible operation of the SN65LVCP23 provides a single device to support the redundant serial bus transmission needs (working and protection switching cards) of fault-tolerant switch systems found in optical networking, wireless infrastructure, and data communications systems. TI offers an additional gigabit repeater/translator in the SN65LVDS101.
The SN65LVCP23 uses a fully differential data path to ensure low-noise generation, fast switching times, low pulse width distortion, and low jitter. Output channel-to-channel skew is less than 10 ps (typ) and 50 ps (max) to ensure accurate alignment of outputs in all applications. Both SOIC and TSSOP package options are available.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 2x2 LVPECL Crosspoint Switch datasheet (Rev. E) | 2006/05/10 | |
| EVM User's guide | SN65LVCP22/23 EVM User's Guide | 2003/06/18 |
설계 및 개발
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| 패키지 | 핀 | 다운로드 |
|---|---|---|
| SOIC (D) | 16 | 옵션 보기 |
| TSSOP (PW) | 16 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치