인터페이스 LVDS, M-LVDS 및 PECL

SN65LVDM176

활성

반이중 LVDM 트랜시버

제품 상세 정보

Function Transceiver Protocols LVDM, LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (MBits) 400 Input signal LVDM, LVTTL Output signal LVDM, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
Function Transceiver Protocols LVDM, LVDS Number of transmitters 1 Number of receivers 1 Supply voltage (V) 3.3 Signaling rate (MBits) 400 Input signal LVDM, LVTTL Output signal LVDM, LVTTL Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 8 29.4 mm² 4.9 x 6 VSSOP (DGK) 8 14.7 mm² 3 x 4.9
  • Low-Voltage Differential Driver and Receiver for Half-Duplex Operation
  • Designed for Signaling Rates of 400 Mbit/s
  • ESD Protection Exceeds 15 kV on Bus Pins
  • Operates From a Single 3.3-V Supply
  • Low-Voltage Differential Signaling With Typical Output Voltages of 350 mV and a 50- Load
  • Valid Output With as Little as 50 mV Input Voltage Difference
  • Propagation Delay Times
    • Driver: 1.7 ns Typ
    • Receiver: 3.7 ns Typ
  • Power Dissipation at 200 MHz
    • Driver: 50 mW Typical
    • Receiver: 60 mW Typical
  • LVTTL Levels Are 5-V Tolerant
  • Bus Pins Are High Impedance When Disabled or With VCC Less Than 1.5 V
  • Open-Circuit Fail-Safe Receiver
  • Surface-Mount Packaging
    • D Package (SOIC)
    • DGK Package (MSOP)

PowerPAD is a trademark of Texas Instruments.

  • Low-Voltage Differential Driver and Receiver for Half-Duplex Operation
  • Designed for Signaling Rates of 400 Mbit/s
  • ESD Protection Exceeds 15 kV on Bus Pins
  • Operates From a Single 3.3-V Supply
  • Low-Voltage Differential Signaling With Typical Output Voltages of 350 mV and a 50- Load
  • Valid Output With as Little as 50 mV Input Voltage Difference
  • Propagation Delay Times
    • Driver: 1.7 ns Typ
    • Receiver: 3.7 ns Typ
  • Power Dissipation at 200 MHz
    • Driver: 50 mW Typical
    • Receiver: 60 mW Typical
  • LVTTL Levels Are 5-V Tolerant
  • Bus Pins Are High Impedance When Disabled or With VCC Less Than 1.5 V
  • Open-Circuit Fail-Safe Receiver
  • Surface-Mount Packaging
    • D Package (SOIC)
    • DGK Package (MSOP)

PowerPAD is a trademark of Texas Instruments.

The SN65LVDM176 is a differential line driver and receiver configured as a transceiver that uses low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbit/s. These circuits are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts except that the output current of the drivers is doubled. This modification provides a minimum differential output voltage magnitude of 247 mV into a 50- load and allows double-terminated lines and half-duplex operation. The receivers detect a voltage difference of less than 50 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for half-duplex or multiplex baseband data transmission over controlled impedance media of approximately 100- characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application specific characteristics).

The SN65LVDM176 is characterized for operation from \x9640°C to 85°C.

The SN65LVDM176 is a differential line driver and receiver configured as a transceiver that uses low-voltage differential signaling (LVDS) to achieve signaling rates as high as 400 Mbit/s. These circuits are similar to TIA/EIA-644 standard compliant devices (SN65LVDS) counterparts except that the output current of the drivers is doubled. This modification provides a minimum differential output voltage magnitude of 247 mV into a 50- load and allows double-terminated lines and half-duplex operation. The receivers detect a voltage difference of less than 50 mV with up to 1 V of ground potential difference between a transmitter and receiver.

The intended application of this device and signaling technique is for half-duplex or multiplex baseband data transmission over controlled impedance media of approximately 100- characteristic impedance. The transmission media may be printed-circuit board traces, backplanes, or cables. (Note: The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media, the noise coupling to the environment, and other application specific characteristics).

The SN65LVDM176 is characterized for operation from \x9640°C to 85°C.

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기술 문서

star =TI에서 선정한 이 제품의 인기 문서
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모두 보기5
유형 직함 날짜
* Data sheet High-Speed Differential Line Transceiver datasheet (Rev. D) 2000/08/03
Application note An Introduction to M-LVDS and Clock and Data Distribution Applications (Rev. C) PDF | HTML 2023/06/22
Application brief How Far, How Fast Can You Operate MLVDS? 2018/08/06
Application note Transmission at 200 Mbps in VME Card Cage Using LVDM (Rev. A) 2002/01/04
Application note SPI-Based Data Acquisition/Monitor Using the TLC2551 Serial ADC (Rev. A) 2001/11/20

설계 및 개발

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시뮬레이션 모델

SN65LVDM176 IBIS Model

SLLM011.ZIP (50 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
시뮬레이션 툴

TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
사용 설명서: PDF
패키지 다운로드
SOIC (D) 8 옵션 보기
VSSOP (DGK) 8 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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