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TLK1221

활성

소형 40핀 패키지의 기가비트 이더넷 시리얼라이저/디시리얼라이저

제품 상세 정보

Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
Protocols Catalog Rating Catalog Operating temperature range (°C) -40 to 85
VQFN (RHA) 40 36 mm² 6 x 6
  • 0.6- to 1.3-Gigabits Per Second (Gbps) Serializer/Deserializer
  • Low Power Consumption 250 mW (typ) at 1.25 Gbps
  • LVPECL-Compatible Differential I/O on High-Speed Interface
  • Single Monolithic PLL Design
  • Support For 10-Bit Interface
  • Fast Relock Times Less Than 256 ns (typ) Suitable for EPON/GEPON Applications such as OLT and ONU Systems
  • Receiver Differential-Input Thresholds, 200-mV Minimum
  • Industrial Temperature Range From –40°C to 85°C
  • IEEE 802.3 Gigabit Ethernet Compliant
  • Designed in 0.25 µm CMOS Technology
  • No External Filter Capacitors Required
  • Comprehensive Suite of Built-In Testability
  • 2.5-V Supply Voltage for Lowest-Power Operation
  • 3.3-V Tolerant on LVTTL Inputs
  • Hot Plug Protection
  • 40-Pin 6-mm × 6-mm QFN PowerPAD™ Package

All trademarks are the property of their respective owners.

  • 0.6- to 1.3-Gigabits Per Second (Gbps) Serializer/Deserializer
  • Low Power Consumption 250 mW (typ) at 1.25 Gbps
  • LVPECL-Compatible Differential I/O on High-Speed Interface
  • Single Monolithic PLL Design
  • Support For 10-Bit Interface
  • Fast Relock Times Less Than 256 ns (typ) Suitable for EPON/GEPON Applications such as OLT and ONU Systems
  • Receiver Differential-Input Thresholds, 200-mV Minimum
  • Industrial Temperature Range From –40°C to 85°C
  • IEEE 802.3 Gigabit Ethernet Compliant
  • Designed in 0.25 µm CMOS Technology
  • No External Filter Capacitors Required
  • Comprehensive Suite of Built-In Testability
  • 2.5-V Supply Voltage for Lowest-Power Operation
  • 3.3-V Tolerant on LVTTL Inputs
  • Hot Plug Protection
  • 40-Pin 6-mm × 6-mm QFN PowerPAD™ Package

All trademarks are the property of their respective owners.

The TLK1221 gigabit Ethernet transceiver provides for high-speed full-duplex point-to-point data transmissions. These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3 Gigabit Ethernet specification. The TLK1221 supports data rates from 0.6 Gbps through 1.3 Gbps.

The primary application of these devices is to provide building blocks for point-to-point baseband data transmission over controlled-impedance media of 50 . The transmission media can be printed-circuit board traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The TLK1221 performs the data serialization, deserialization, and clock extraction functions for a physical layer interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over a copper or optical media interface.

This device supports the defined 10-bit interface (TBI). In the TBI mode, the serializer/deserializer (SERDES) accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted differentially at PECL-compatible voltage levels. The SERDES extracts clock information from the input serial stream and deserializes the data, outputting a parallel 10-bit data byte.

A comprehensive series of built-in tests is provided for self-test purposes, including loopback and pseudorandom binary sequence (PRBS) generation and verification.

The TLK1221 is housed in a high-performance, thermally enhanced, 40-pin QFN package. Use of this package does not require any special considerations except to note that the pad, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is required that the TLK1221 pad be soldered to the thermal land on the board as it serves as the main ground connection for the device.

The TLK1221 is characterized for operation from –40°C to 85°C.

This device uses a 2.5-V supply. The I/O section is 3.3-V compatible. With the 2.5-V supply, the chipset is very power-efficient, dissipating less than 200 mW typical power when operating at 1.25 Gbps.

The TLK1221 is designed to be hot-plug capable. A power-on reset causes RBC0, RBC1, the parallel output signal terminals, TXP, and TXN to be held in the high-impedance state.

The TLK1221 gigabit Ethernet transceiver provides for high-speed full-duplex point-to-point data transmissions. These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3 Gigabit Ethernet specification. The TLK1221 supports data rates from 0.6 Gbps through 1.3 Gbps.

The primary application of these devices is to provide building blocks for point-to-point baseband data transmission over controlled-impedance media of 50 . The transmission media can be printed-circuit board traces, copper cables or fiber-optical media. The ultimate rate and distance of data transfer is dependent upon the attenuation characteristics of the media and the noise coupling to the environment.

The TLK1221 performs the data serialization, deserialization, and clock extraction functions for a physical layer interface device. The transceiver operates at 1.25 Gbps (typical), providing up to 1 Gbps of data bandwidth over a copper or optical media interface.

This device supports the defined 10-bit interface (TBI). In the TBI mode, the serializer/deserializer (SERDES) accepts 10-bit wide 8b/10b parallel encoded data bytes. The parallel data bytes are serialized and transmitted differentially at PECL-compatible voltage levels. The SERDES extracts clock information from the input serial stream and deserializes the data, outputting a parallel 10-bit data byte.

A comprehensive series of built-in tests is provided for self-test purposes, including loopback and pseudorandom binary sequence (PRBS) generation and verification.

The TLK1221 is housed in a high-performance, thermally enhanced, 40-pin QFN package. Use of this package does not require any special considerations except to note that the pad, which is an exposed die pad on the bottom of the device, is a metallic thermal and electrical conductor. It is required that the TLK1221 pad be soldered to the thermal land on the board as it serves as the main ground connection for the device.

The TLK1221 is characterized for operation from –40°C to 85°C.

This device uses a 2.5-V supply. The I/O section is 3.3-V compatible. With the 2.5-V supply, the chipset is very power-efficient, dissipating less than 200 mW typical power when operating at 1.25 Gbps.

The TLK1221 is designed to be hot-plug capable. A power-on reset causes RBC0, RBC1, the parallel output signal terminals, TXP, and TXN to be held in the high-impedance state.

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기술 문서

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모두 보기2
유형 직함 날짜
* Data sheet Ethernet Transceivers datasheet (Rev. C) 2009/09/01
EVM User's guide TLK1221 Ethernet Transceiver EVM 2007/09/27

설계 및 개발

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평가 보드

TLK1221EVM — TLK1221EVM 평가 모듈

The TLK1221 gigabit Ethernet transceiver provides for high-speed full-duplex point-to-point data transmissions.These devices are based on the timing requirements of the 10-bit interface specification by the IEEE 802.3Gigabit Ethernet specification. The TLK1221 supports data rates from 0.6 Gbps (...)

사용 설명서: PDF
TI.com에서 구매할 수 없습니다
시뮬레이션 모델

TLK1221 IBIS Model

SLLM082.ZIP (17 KB) - IBIS Model
시뮬레이션 툴

PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®

TI용 PSpice®는 아날로그 회로의 기능을 평가하는 데 사용되는 설계 및 시뮬레이션 환경입니다. 완전한 기능을 갖춘 이 설계 및 시뮬레이션 제품군은 Cadence®의 아날로그 분석 엔진을 사용합니다. 무료로 제공되는 TI용 PSpice에는 아날로그 및 전력 포트폴리오뿐 아니라 아날로그 행동 모델에 이르기까지 업계에서 가장 방대한 모델 라이브러리 중 하나가 포함되어 있습니다.

TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
시뮬레이션 툴

TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
사용 설명서: PDF
패키지 다운로드
VQFN (RHA) 40 옵션 보기

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

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