TMUX154E
- VCC Operation at 3 V to 4.3 V
- I/O Pins Can Tolerate up to 5.25 V
- 1.8-V Compatible Control Logic
- Supports Powered-off Protection I/O Pins Hi-Z When VCC = 0 V
- RON = 10 Ω Maximum
- ΔRON = 0.35 Ω Typical
- Cio(ON) = 7.5 pF Typical
- Low Power Consumption (1 uA Maximum)
- –3-dB Bandwidth = 900 MHz Typical
- Latch-Up Performance Exceeds
100 mA Per JESD 78, Class II (1) - ESD Performance Tested Per JESD 22
- 8000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 8000-V Human-Body Model
- ESD Performance I/O Port to GND (2)
- 15000-V Human-Body Model
(1)Except EN and SEL Inputs
(2)High-voltage HBM is performed in addition to the standard HBM testing (A114-B, Class II) and applies to I/O ports tested with respect to GND only.
The TMUX154E is a high-bandwidth 2:1 switch specially designed for the switching of high-speed signals in applications with limited I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The switch is bidirectional and offers little or no attenuation of high-speed signals. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation.
The TMUX154E integrates ESD protection cells on all pins, is available in a tiny UQFN package (1.8 mm × 1.4 mm) or a VSSOP package, and is characterized over the free-air temperature range of –40°C to 85°C.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX154E ESD-Protected, Low Capacitance, 2-Channel, 2:1 Switch, With Powered-off Protection datasheet | PDF | HTML | 2018/02/06 |
| Application brief | Important Multiplexer Characteristics for I3C Applications | PDF | HTML | 2023/07/27 | |
| Application brief | Best Practices: I2C Devices on an I3C Shared Bus | PDF | HTML | 2023/03/30 | |
| Application brief | 1.8-V Logic for Multiplexers and Signal Switches (Rev. C) | PDF | HTML | 2022/07/26 | |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
| Application brief | Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) | PDF | HTML | 2021/01/06 | |
| Technical article | Roll with the design punches and overcome power-sequencing challenges | PDF | HTML | 2019/07/29 | |
| Application brief | Improve Stability Issues with Low Con Multiplexers (Rev. A) | 2018/12/10 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| UQFN (RSW) | 10 | 옵션 보기 |
| VSSOP (DGS) | 10 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.