TMUX6113
- Wide Supply Range: ±5 V to ±17 V (dual),
10 V to 17 V (single) - Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
- Low On-Capacitance: 4.2 pF
- Low Input Leakage: 0.5 pA
- Low Charge Injection: 0.6 pC
- Rail-to-Rail Operation
- Low On-Resistance: 120 Ω
- Fast Switch Turn-On Time: 66 ns
- Break-Before-Make Switching (TMUX6113)
- EN Pin Connectable to VDD
- Low Supply Current: 17 µA
- Human Body Model (HBM) ESD Protection: ± 2 kV on All Pins
- Industry-Standard TSSOP and smaller WQFN Packages
The TMUX6111, TMUX6112, and TMUX6113 devices are modern complementary metal-oxide semiconductor (CMOS) devices that have four independently selectable single-pole/ single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±17 V), a single supply (10 V to 17 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring TTL/ CMOS logic compatibility.
The switches are turned on with Logic 0 on the digital control inputs in the TMUX6111. Logic 1 is required to turn on switches in the TMUX6112. The TMUX6113 has two switches with similar digital control logic to the TMUX6111 while the logic is inverted on the other two switches. The TMUX6113 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.
The TMUX611x devices are part of Texas Instruments Precision Switches and Multiplexers family. The devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the device usage in portable applications.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX611x ±17-V, Low-capacitance, Low-leakage-current, Precision, Quad SPST Switches datasheet (Rev. E) | PDF | HTML | 2019/12/13 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
| Application note | Guarding in Multiplexer Applications | PDF | HTML | 2022/05/13 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
| Application brief | Improve Stability Issues with Low Con Multiplexers (Rev. A) | 2018/12/10 | ||
| Application note | System Level Protection for High Voltage Analog Multiplexers | 2017/01/03 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| TSSOP (PW) | 16 | 옵션 보기 |
| WQFN (RTE) | 16 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.