TMUX6119
- Wide Supply Range: ±5 V to ±16.5 V (Dual) or 10 V to 16.5 V (Single)
- Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
- Low On-Capacitance: 6.4 pF
- Low Input Leakage: 0.5 pA
- Low Charge Injection: 0.19 pC
- Rail-to-Rail Operation
- Low On-Resistance: 120 Ω
- Transition Time: 68 ns
- Break-Before-Make Switching Action
- EN Pin and SEL Pin Connectable to VDD with Integrated Pull-down
- Logic Levels: 2 V to VDD
- Low Supply Current: 17 µA
- Human Body Model (HBM) ESD Protection: ±2 kV on All Pins
- Industry-Standard SOT-23 Package
The TMUX6119 is a modern complementary metal-oxide semiconductor (CMOS) single-pole, double throw (SPDT) switch. The device works well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. Both digital input pins (EN and SEL) have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL/ CMOS logic compatibility.
The TMUX6119 can be enabled or disabled by controlling the EN pin. When disabled, both channel switches are off. When enabled, the SEL pin can be used to turn on channel A (SA to D) or channel B (SB to D). Each channel conducts equally well in both directions and has an input signal range that extends to the supplies. The switches of TMUX6119 exhibit break-before-make (BBM) switching action.
The TMUX6119 is part of Texas Instruments Precision Switches and Multiplexers family. The TMUX6119 has very low leakage currents and charge injection, allowing the device to be used in high precision measurement applications. The device also provides excellent isolation capability by blocking signal levels up to the supplies when the switches are in the OFF position. A low supply current of 17 µA enables usage in portable applications.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TMUX6119 ±16.5-V, Low Capacitance, Low-Leakage-Current, Precision, SPDT Switch datasheet (Rev. A) | PDF | HTML | 2018/12/11 |
| Application note | Selecting the Correct Texas Instruments Signal Switch (Rev. E) | PDF | HTML | 2022/06/02 | |
| Application note | Multiplexers and Signal Switches Glossary (Rev. B) | PDF | HTML | 2021/12/01 | |
| Application note | System Level Protection for High Voltage Analog Multiplexers | 2017/01/03 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LEADED-ADAPTER1 — TI의 5, 8, 10, 16 및 24핀 리드 패키지의 빠른 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| SOT-23 (DCN) | 8 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.