TPA3001D1
- 20 W Into 8-
Load From 18-V Supply (10% THD+N) - Short-Circuit Protection (Short to VCC, Short to GND,
Short Between Outputs) - Third-Generation Modulation Technique:
- Replaces Large LC Filter With Small, Low-Cost Ferrite
Bead Filter in Most Applications - Improved Efficiency
- Improved SNR
- Replaces Large LC Filter With Small, Low-Cost Ferrite
- Low Supply Current: 8 mA Typ at 12 V
- Shutdown Control: < 1 µA Typ
- Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
- APPLICATIONS
- LCD Monitors/TVs
- Hands-Free Car Kits
- Powered Speakers
PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4- or 8- speakers with only a ferrite bead filter required to reduce EMI.
The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.
The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.
The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | 20W Mono Class-D Audio Power Amplifier datasheet (Rev. E) | 2010/08/23 | |
| Application note | Layout Guidelines For TPA300x Series Parts (Rev. A) | 2020/06/24 | ||
| Application note | Using Thermal Calculation Tools for Analog Components (Rev. A) | 2019/08/30 | ||
| Application note | Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) | 2019/08/26 | ||
| Application note | AN-1849 An Audio Amplifier Power Supply Design (Rev. C) | 2019/06/27 | ||
| Application note | AN-1737 Managing EMI in Class D Audio Applications (Rev. A) | 2013/05/01 |
설계 및 개발
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| 패키지 | 핀 | 다운로드 |
|---|---|---|
| HTSSOP (PWP) | 24 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치