홈 스위치 및 멀티플렉서 프로토콜별 스위치 및 멀티플렉서
홈
스위치 및 멀티플렉서
프로토콜별 스위치 및 멀티플렉서

TS3DS10224

활성

3.3V, 4:1 차동 1채널 또는 2:1 차동 2채널 아날로그 멀티플렉서

지금 주문
데이터시트

TS3DS10224

활성
데이터시트 지금 주문

제품 상세 정보

Protocols USB 2.0 Configuration Crosspoint/exchange Number of channels 2 Bandwidth (MHz) 1200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 13000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 50 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 Input/output continuous current (max) (mA) 100 COFF (typ) (pF) 6 CON (typ) (pF) 12 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 5 Propagation delay time (µs) 0.00005 Ron (max) (mΩ) 19000 Ron channel match (max) (Ω) 2.5 RON flatness (typ) (Ω) 4 Turnoff time (disable) (max) (ns) 100 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 2.3 VIL (max) (V) 0.6
Protocols USB 2.0 Configuration Crosspoint/exchange Number of channels 2 Bandwidth (MHz) 1200 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 13000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 3.6 Supply current (typ) (µA) 50 ESD HBM (typ) (kV) 2.5 Operating temperature range (°C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 Input/output continuous current (max) (mA) 100 COFF (typ) (pF) 6 CON (typ) (pF) 12 Off isolation (typ) (dB) -30 OFF-state leakage current (max) (µA) 5 Propagation delay time (µs) 0.00005 Ron (max) (mΩ) 19000 Ron channel match (max) (Ω) 2.5 RON flatness (typ) (Ω) 4 Turnoff time (disable) (max) (ns) 100 Turnon time (enable) (max) (ns) 30 VIH (min) (V) 2.3 VIL (max) (V) 0.6
WQFN (RUK) 20 9 mm² 3 x 3
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)
  • Can be configured for
    • Differential Crosspoint Switching
    • Differential Single Channel 1:4 Multiplexer and Demultiplexer
    • Differential 2-Channel 1:2 Multiplexer and Demultiplexer
    • Differential Fan-Out of Signal Pair to Two Ports Simultaneously
  • Bidirectional Operation
  • Fail-Safe Protection: IOFF Protection Prevents Current Leakage in Powered-Down State
    (VCC = 0 V)
  • High BW (1.2 GHz Typical)
  • Low RON and CON:
    • 13-Ω RON Typical
    • 9-pF CON Typical
  • ESD Performance (I/O Pins)
    • ±8-kV Contact Discharge (IEC61000-4-2)
    • 2-kV Human-Body Model per JESD22-A114E (to GND)
  • ESD Performance (All Pins)
    • 2-kV Human-Body Model per JESD22-A114E
  • Small WQFN package (3.00 mm × 3.00 mm,
    0.4-mm pitch)

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.

The TS3DS10224 device is a bidirectional differential crosspoint, 1:4, or 1:2 multiplexer and demultiplexer; or fan-out switch for high-speed differential signal applications (up to 720 Mbps). The TS3DS10224 logic table can route any input to any output creating a wide range of possible switching or multiplexing configurations. Common configurations include: differential crosspoint switching, differential 1:4 mux, or differential 2-channel 1:2 multiplexer and demultiplexer. The TS3DS10224 offers a high BW of 1.2 GHz with channel RON of 13 Ω (typical).

The TS3DS10224 can also be used to fan out a differential signal pair to two ports simultaneously (fan-out configuration). The BW performance is lower in this configuration.

The TS3DS10224 operates with a 3-V to 3.6-V power supply. It features ESD protection of up to ±8-kV contact discharge and 2-kV human-body model on its I/O pins.

The TS3DS10224 provides fail-safe protection by isolating the I/O pins with high impedance when the power supply (VCC) is not present.
open-in-new 기타 프로토콜별 스위치 및 멀티플렉서 찾기
다운로드 스크립트와 함께 비디오 보기 동영상

기술 문서

star =TI에서 선정한 이 제품의 인기 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기3
유형 직함 날짜
* Data sheet TS3DS10224 High-Speed Differential Crosspoint, 1:4 Differential Multiplexer and Demultiplexer, 2 Channel Differential 1:2 Multiplexer and Demultiplexer, or Fan-Out Switch datasheet (Rev. E) PDF | HTML 2019/10/17
Application note Preventing Excess Power Consumption on Analog Switches 2008/07/03
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08

설계 및 개발

추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.

인터페이스 어댑터

LEADLESS-ADAPTER1 — TI의 6, 8, 10, 12, 14, 16 및 20핀 리드 없는 패키지의 테스트를 위한 DIP 헤더 어댑터에 대한 표면 실장

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
사용 설명서: PDF
TI.com에서 구매할 수 없습니다
시뮬레이션 모델

TS3DS10224 HSpice AIO (Linux) Model

SCDM137.ZIP (511 KB) - HSpice Model
다운로드
시뮬레이션 모델

TS3DS10224 HSpice AIO (Windows) Model

SCDM136.ZIP (511 KB) - HSpice Model
다운로드
시뮬레이션 모델

TS3DS10224 IBIS Model

SCDM301.ZIP (4 KB) - IBIS Model
다운로드
패키지 핀 다운로드
WQFN (RUK) 20 옵션 보기
TI의 평가 항목에 대한 표준 약관이 적용됩니다.

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.

지원 및 교육

TI 엔지니어의 기술 지원을 받을 수 있는 TI E2E™ 포럼

포럼 주제 모두 보기(영문)

콘텐츠는 TI 및 커뮤니티 기고자에 의해 "있는 그대로" 제공되며 TI의 사양으로 간주되지 않습니다. 사용 약관을 참조하십시오.

품질, 패키징, TI에서 주문하는 데 대한 질문이 있다면 TI 지원을 방문하세요. ​​​​​​​​​​​​​​

동영상