TS3USB3031
- VCC Range: 2.5 V to 4.3 V
- Mobile High-definition Link (MHL) or Mobility Display Port (MyDP) Switch:
- Bandwidth (–3 dB): 6.5 GHz
- RON (Typical): 5.5 Ω
- CON (Typical): 1.3 pF
- USB Switches (2 Sets):
- Bandwidth (–3 dB): 6.5 GHz
- RON (Typical): 4.5 Ω
- CON (Typical): 1 pF
- Current Consumption: 28 µA (Typical)
- Special Features:
- IOFF Protection Prevents Current Leakage in Powered-Down State (VCC = 0 V)
- 1.8-V Compatible Control Inputs (SEL)
- Overvoltage Tolerance (OVT) on All I/O Pins up to 5.5 V Without External Components
- ESD Performance:
- 2-kV Human-Body Model (A114B, Class II)
- 1-kV Charged-Device Model (C101)
- Package:
- 12-Pin VQFN Package (1.8-mm × 1.8-mm, 0.5-mm Pitch)
The TS3USB3031 device is a 2-channel, 1:3 multiplexer that includes a high-speed Mobile High-Definition Link (MHL), Mobility Display Port (MyDP) switch, and USB 2.0 High-Speed (480 Mbps) switches in the same package. These configurations allow the system designer to save board space and eliminate multiple connectors buy using a common USB or Mico-USB connector for MHL/MyDP signals and two sets of USB data. The MHL/MyDP path supports the latest MHL Rev. 3.0 specification.
The TS3USB3031 has a VCC range of 2.5 V to 4.3 V and supports overvoltage tolerance (OVT) feature, which allows the I/O pins to withstand overvoltage conditions (up to 5.5 V). The power-off protection feature forces all I/O pins to be in high impedance mode when power is not present, allowing full isolation of the signals lines under such condition without excessive leakage current. The select pins of TS3USB3031 are compatible with 1.8-V control voltage, allowing them to be directly interfaced with the General Purpose I/O (GPIO) from a mobile processor with out needing additional voltage level shifting circuitry.
The TS3USB3031 comes with a small 12-pin VQFN package with only 1.8 mm × 1.8 mm in size, which makes it a perfect candidate to be used in mobile applications.
기술 문서
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | TS3USB3031 2-Channel, 1:3, USB 2.0 High-Speed (480 Mbps) and Mobile High-Definition Link (MHL) or Mobility Display Port (MyDP) Switch datasheet (Rev. C) | PDF | HTML | 2017/03/19 |
Application note | Passive Mux Selection Based On Bandwidth > Ron | 2019/09/11 | ||
Application note | High-Speed Layout Guidelines for Signal Conditioners and USB Hubs | 2018/06/14 | ||
Application note | TMDS Clock Detection Solution in HDMI Sink Applications | 2017/08/23 | ||
EVM User's guide | TS3USB3031 EVM User's Guide | 2013/09/23 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
패키지 | 핀 | 다운로드 |
---|---|---|
WQFN (RMG) | 12 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.