TSM24B
- Robust surge protection:
- IEC61000-4-5 (8/20 µs): 20 A
- Low clamping voltage of 33 V (typical) at 20 A for 8/20 µs surge current protects downstream components
- Unidirectional polarity for optimized clamping performance on single ended data lines and power rails
- 24 V working voltage for protecting signals on 12 V systems
- Low leakage current of 75 nA (maximum)
- Low I/O capacitance of 24 pF (typical)
- Integrated IEC 61000-4-2 ESD protection
- ±30-kV contact discharge
- ±30-kV air-gap discharge
- Small SOT-23 leaded package to minimize board space and allow for automatic optical inspection (AOI)
The TSM24B is a part of TI’s surge protection device family. The TSM24B robustly shunts up to 20 A of IEC 61000-4-5 fault current to protect systems from high power transients or lightning strikes. The TSM24B is rated to dissipate ESD strikes beyond the maximum level specified in the IEC 61000-4-2 international standard (±30-kV contact, ±30-kV air-gap). The TSM24B clamps during a surge event, keeping system exposure below 33 V (typical) at I PP = 20 A.
Additionally, the TSM24B is available in a small leaded SOT-23 (DBZ) package, which is reduced in size by approximately 50 percent compared to the industry standard SMA package. The device is designed to have a minimal effect on the protected line due to extremely low device leakage.
기술 문서
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TSM24B Unidirectional Surge Protection Device in SOT-23 datasheet (Rev. A) | PDF | HTML | 2023/10/27 |
설계 및 개발
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ESDEVM — 일반 ESD 평가 모듈
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| 패키지 | 핀 | 다운로드 |
|---|---|---|
| SOT-23 (DBZ) | 3 | 옵션 보기 |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치