SBOS473F March 2009  – February 2018 TMP112

PRODUCTION DATA. 

  1. 1     Features
  2. 2     Applications
  3. 3     Description
  4. DeviceImages
    1. BlockDiagram
  5. 4     Revision History
  6. 5     Pin Configuration and Functions
    1. PinFunctions
  7. 6     Specifications
    1. 6.1Absolute Maximum Ratings
    2. 6.2ESD Ratings
    3. 6.3Recommended Operating Conditions
    4. 6.4Thermal Information
    5. 6.5Electrical Characteristics
    6. 6.6Timing Requirements
    7. 6.7Typical Characteristics
  8. 7     Detailed Description
    1. 7.1Overview
    2. 7.2Functional Block Diagrams
    3. 7.3Feature Description
      1. 7.3.1Digital Temperature Output
      2. 7.3.2Serial Interface
        1. 7.3.2.1Bus Overview
        2. 7.3.2.2Serial Bus Address
        3. 7.3.2.3Writing and Reading Operation
        4. 7.3.2.4Slave Mode Operations
          1. 7.3.2.4.1Slave Receiver Mode
          2. 7.3.2.4.2Slave Transmitter Mode
        5. 7.3.2.5SMBus Alert Function
        6. 7.3.2.6General Call
        7. 7.3.2.7High-Speed (Hs) Mode
        8. 7.3.2.8Timeout Function
        9. 7.3.2.9Timing Diagrams
          1. 7.3.2.9.1Two-Wire Timing Diagrams
    4. 7.4Device Functional Modes
      1. 7.4.1Continuos-Conversion Mode
      2. 7.4.2Extended Mode (EM)
      3. 7.4.3One-Shot/Conversion Ready Mode (OS)
      4. 7.4.4Thermostat Mode (TM)
        1. 7.4.4.1Comparator Mode (TM = 0)
        2. 7.4.4.2Interrupt Mode (TM = 1)
    5. 7.5Programming
      1. 7.5.1Pointer Register
      2. 7.5.2Temperature Register
      3. 7.5.3Configuration Register
        1. 7.5.3.1Shutdown Mode (SD)
        2. 7.5.3.2Thermostat Mode (TM)
        3. 7.5.3.3Polarity (POL)
        4. 7.5.3.4Fault Queue (F1/F0)
        5. 7.5.3.5Converter Resolution (R1 and R0)
        6. 7.5.3.6One-Shot (OS)
        7. 7.5.3.7Extended Mode (EM)
        8. 7.5.3.8Alert (AL)
      4. 7.5.4High- and Low-Limit Register
  9. 8     Application and Implementation
    1. 8.1Application Information
    2. 8.2Typical Application
      1. 8.2.1Design Requirements
      2. 8.2.2Detailed Design Procedure
      3. 8.2.3Application Curves
  10. 9     Power Supply Recommendations
  11. 10    Layout
    1. 10.1Layout Guidelines
    2. 10.2Layout Example
  12. 11    Device and Documentation Support
    1. 11.1Documentation Support
      1. 11.1.1Related Documentation
    2. 11.2Community Resources
    3. 11.3Trademarks
    4. 11.4Electrostatic Discharge Caution
    5. 11.5Glossary
  13. 12    Mechanical, Packaging, and Orderable Information

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Mechanical Data (Package|Pins)
Orderable Information