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TI Drives the Emerging World Without Wires
Wireless Overview
Today, 20 years after the introduction of the first commercial cellular telephones, millions of people around the world depend on wireless technology to access people and information anytime and anywhere. Consumers have embraced the technology's ease of use, portability and improved bandwidth, as well as the ability to personalize the equipment, services and overall functionality of their wireless experience.
What TI Delivers to the Wireless Market Place
In the era of next-generation wireless communications, mobile devices and networks will begin and end with real time communications. This is where Texas Instruments Incorporated has proven its leadership - not only in wireless, but Internet audio, digital still camera and broadband technologies. TI's customers put its digital signal processing (DSP) and analog technology first, making them the semiconductors engines of the Internet age. They enable real-time communications and therefore a whole range of new applications such as multimedia messaging, streaming video and audio, speech recognition, security, location-based services, e-commerce together on wireless networks and devices, meeting consumers' top demand: access to information, instantly.
For more than six decades, TI has created innovations in mobile communication, including the first commercial silicon transistors in 1954, the first integrated circuit, and the first electronic handheld calculator. Silicon increased the performance while lowering operating temperatures, enabling the miniaturization of electronics - a major step forward for mobile communications. Over the years, TI developed even higher-performance and lower-power semiconductors and worked with its customers to develop smaller and lighter-weight wireless phones, the first and second generations of wireless technology. TI chips today process billions of instructions per second providing the power behind all points in telecommunications - from wireless handsets and Internet devices to networks.
TI's programmable DSP technology is key to maximizing companies' investments in a state of evolving technology. Programmability allows manufacturers and telecommunications operators to reuse valuable engineering design from previous generations to build multiple product lines, enabling backward and forward compatibility for smooth transitions as standards evolve. This results in shorter time-to-market and lower development costs.
TI's technology provides benefits to all areas of wireless communications, from the handset manufacturer to the telecommunications service provider.
- Handsets
Fifty-eight percent of today's wireless handsets incorporate TI's DSPs (source: Forward Concepts). Further establishing TI as the leader for next-generation products, the top wireless equipment manufacturers including Nokia, Ericsson, Sendo and Sony already have chosen TI's technology for their future 2.5 and 3G devices. Similarly, multiple operating system vendors including Microsoft, Symbian, Palm and Sun have endorsed TI's solutions.
TI provides complete "antenna-to-applications" chipset solutions, including integrated families of digital baseband modems, analog and power management integrated circuits, RF processing and powerful application processors. To enhance system flexibility, TI also includes a complete range of peripheral support, including, including USB, Bluetooth™, removable flash cards, camera controllers, stereo codecs, drivers and other capabilities. Importantly, in addition to these silicon and software building blocks, TI provides complete handset reference designs that enable customers to rapidly develop and deliver new products. By providing complete end-to-end chipset solutions, TI supplies wireless designers the optimized cost and performance required by consumers.
Addressing the new era of next-generation wireless communications, TI also offers its scalable, open OMAP™ platform that supports all wireless standards, programming languages and operating systems. TI's family of OMAP processors enables a wide variety of devices and never seen before applications that make the Internet more portable and personal.
Delivering the bandwidth and functionality required for real-time communications and multimedia, TI's OMAP processors provide the highest performance with as little as one-fourth the power consumption for high-end 2.5 and 3G wireless handsets and Internet appliances. TI's OMAP platform offers seamless access to its high-performance DSP algorithms and supports all familiar high-level operating systems so no new programming expertise is required. TI also offers OMAP solutions that combine a wireless modem and a dedicated applications processor on a single chip. TI leads the wireless industry in its ability to address unified voice and data products, providing highly integrated solutions that lower system costs and support.
TI works closely with the its OMAP Developers Network, a community of international software developers working to create new and exciting applications. By providing tools, training and a worldwide network of independent OMAP Technology Centers, TI allows developers and customers to quickly develop new applications and products. As further support to the Developers Network, TI has a $100 million OMAP Investment Program to accelerate the creation of software applications for advanced, next generation mobile devices.
- Infrastructure (Telecommunications Networks and Service Providers)
Wireless service providers have invested heavily in developing the marketplace and in purchasing bandwidth to deliver their services across the next-generation wireless infrastructure. Now, wireless infrastructure companies are looking to companies like TI to help them quickly deploy as many channels of next-generation, media-rich wireless connectivity as possible. Channel density translates into the ability to service more customers, which provides a higher return on investment for infrastructure providers as well as service providers.
TI's DSP technology increases channel density by providing the highest performance DSP tailored for 3G wireless infrastructure applications. TI's latest/fastest DSP quadruples wireless basestation channel density and consumes less then one-third the power of its competitors. Also important for base station manufacturers, TI's solutions offer flexibility to support all industry standards.
In addition to channel density, service providers are also seeking the help of companies like TI to provide the engines that support "killer" applications and an enhanced wireless experience that will attract new consumers. As a critical player in the next-generation wireless value chain, TI offers significant benefits for carriers including longer talk times and the ability to optimally run new bandwidth-intensive services. These technologies enable carriers and equipment manufacturers to deliver engaging functionality and extended battery life.
- Wireless Networking
As home and office networking continues to gain momentum, wireless LAN technology will become increasingly significant as consumers. With IEEE 802.11b (also known as Wi-Fi™) and Bluetooth, consumers can easily wire their homes and offices, by using "no wires" networks which connect multiple PCs, peripherals and other Internet appliances to rich content including voice, data and video information. Outside the home and office, consumers are also finding that they can stay connected to their personal business by using PCs with wireless modem cards, that work with the wireless networks now found in many hotels, airports and coffee shops across the country and internationally
As a leader in both Wi-Fi and Bluetooth, TI is well positioned to drive silicon and software trends toward longer reaches and higher data rates, while maintaining the highest levels of performance. TI utilizes Bluetooth technology for creating personal area networks and other short distance wireless applications, while leveraging its Wi-Fi solutions for wireless local area networking. Committed to enabling the price points required for widespread adoption of wireless networking technology, TI delivers highly integrated, high performance solutions with its Bluetooth and 802.11 chipsets. Products using TI's wireless networking chips are expected to be on the market in the fourth quarter of 2001.
TI & The Future of Wireless
TI continues its wireless leadership by supplying the industry's fastest DSPs, lowest-power analog components and the deepest experience in integrated circuit technology. TI's DSP-based solution have set the standard for wireless today and have the performance to deliver any real-time communications application as we move into the future. Wireless industry leaders have made their choice loud and clear by selecting TI's OMAP platform for their 2.5 and 3G handsets and mobile Internet devices.
The long-standing cellular standards battle is also over as leading carriers such as AT&T and Cingular have announced that they would transition their networks to GPRS/WCMDA, the standards that evolved from GSM, the world's leading 2G cellular standard with 70 percent of the market. TI supports all standards and is the leading semiconductor provider for GSM, providing TI with the incumbency advantage for 2.5 and 3G. In wireless networking, TI will extend its standards leadership to continue driving integration, power and performance in innovative standards-based solutions.
In summary, leveraging more than 10 years of wireless expertise, TI has the key partnerships, architecture and systems expertise to continue its leadership into the next generation of wireless communications.
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