DREAM-3P-CC2340

Dreamlink CC2340 Bluetooth module

Overview

DL-CC2340-A & DL-CC2340-B Buetooth Low Energy modules were both designed based on the TI SimpleLink CC2340R5 Bluetooth Low Energy device, which uses a 48-MHz Cortex-M0+ kernel, integrates up to 512 KB of flash memory, 36 KB of SRAM, and has up to 26 universal I/O interfaces. Moreover, these Bluetooth Low Energy modules are equipped with a built-in 48-MHz 10-ppm external high-speed clock and 32.768-kHz external low-speed clock.

The DL-CC2340-A Bluetooth Low Energy module can use a variety of universal peripherals for all I/O ports of the CC2340R5 chip, which includes UART, SPI, I2C, timer, temperature sensor, battery voltage detection, built-in analog comparator, and 12-bit ADC analog-to-digital converter. In addition, to meet the security requirements of Bluetooth, it also has AES-128 encryption and RNG functions. Customers can use the SDK for secondary development, and embed its complete applications.

The DL-CC2340-B Bluetooth Low Energy module has a smaller size, but built-in AT commands, which makes it suitable for use as a UART Bluetooth Low Energy module. The external MCU can be connected to the Bluetooth Low Energy module through the UART interface to achieve Bluetooth Low Energy data transmission. 

In terms of RF performance, these CC2340 Bluetooth Low Energy modules integrate an RF balun internally, with simplified RF design, and reduced power consumption. The typical sensitivity can reach as high as -96.5 dBm @ 1 Mbps, and they can also achieve an output power up to +8 dBm. In order to meet the limit standards for RF power in various countries, the power of the Bluetooth Low Energy module can be adjusted (ranging from -21 dBm to+8 dBm).

Features
  • Hardware parameters:
    • Model No.: DL-CC2340-A / DL-CC2340-B
    • Dimension: 26.5x18 mm / 18x12 mm
    • Chip model: TI CC2340R5
    • Development Method: secondary development / AT Command
    • Module pin number: 40 PIN (25 GPIO) / 20 PIN (15 GPIO)
    • Antenna: PCB antenna + IPEX / PCB antenna + external PAD
    • Working voltage (DC): 1.75~3.8V
    • Working temperature: -40 ℃ ~ +85 ℃
    • Storage temperature: -40 ℃ ~ +85 ℃
  • Wireless characteristics
    • Bluetooth version: supports Bluetooth 5.3
    • Frequency range: 2402-2480 MHz (2.4G ISM radio band)
    • Modulation mode: GFSK
    • Transmission power: -21 dBm ~ +8 dBm (can be programed via software)
    • Receiving sensitivity: -96 dBm (typical value @ 1 Mbps)
    • Transparent mode: master/slave
    • Communication range: 70 meters (open area)
  • Power consumption parameters
    • Active mode RX: 5.3 mA
    • Active mode TX: 5 mA @ 0dBm; 12 mA @+8dBm
    • Sleep state: sleep state 0.7-µA avg (RTC running and RAM/CPU holding)
    • Running: 2.6-mA active mode
    • Data transmission: to be updated
  • Software parameters
    • Supported protocols:
      • Bluetooth ® 5.3 Low Energy
      • Zigbee ® 1
      • SimpleLink ™ TI 15.4-stack 1
  • OTA: available
  • Master slave integration: available
Low-power 2.4-GHz products
CC2340R2 SimpleLink™ 32-bit Arm® Cortex®-M0+ Bluetooth® Low Energy wireless MCU with 256kB Flash CC2340R5 SimpleLink™ 32-bit Arm® Cortex®-M0+ Bluetooth® Low Energy wireless MCU with 512-kB flash
Download View video with transcript Video
Photos courtesy of Shenzhen DreamLNK Technology Co., Ltd.

Order & start development

Evaluation board

DL-CC2340-B — Bluetooth Low Energy module

TI's Standard Terms and Conditions for Evaluation Items apply.

Support & training

Videos

Disclaimer

Certain information and resources (including links to non-TI sites) above may be provided by a third-party partner, and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of any third-party company by TI, and shall not be construed as a warranty or representation regarding the suitability of any third-party products or services, either alone or in combination with any TI product or service.