This envelope-tracking power reference design maintains helps extend battery life in a portable audio applications, such as Bluetooth® or Wi-Fi speakers. The low-power step-down converter in the design features envelope-tracking capability to an audio power amplifier, maintaining high efficiency across the output voltage range. By adding an audio envelope signal to the FB pin of TI’s TPS61178 device, the output voltage can change in accordance with the envelope of the audio signal thus dynamically adapting the TPA3128D2 power amplifier’s supply and optimizing its power consumption.
| Output voltage options | PMP15036.1 |
|---|---|
| Vin (Min) (V) | 5.4 |
| Vin (Max) (V) | 8.4 |
| Vout (Nom) (V) | 18 |
| Iout (Max) (A) | 1.5 |
| Output Power (W) | 27 |
| Isolated/Non-Isolated | Non-Isolated |
| Input Type | DC |
| Topology | Boost- Synchronous |
A fully assembled board has been developed for testing and performance validation only, and is not available for sale.
Download ready-to-use system files to speed your design process.
Test results for the reference design, including efficiency graphs, test prerequisites and more
Detailed schematic diagram for design layout and components
Complete listing of design components, reference designators, and manufacturers/part numbers
Detailed overview of design layout for component placement
Files used for 3D models or 2D drawings of IC components
Design file that contains information on physical board layer of design PCB
PCB layer plot file used for generating PCB design layout
Includes TI products in the design and potential alternatives.
| Type | Title | Date | ||
|---|---|---|---|---|
| * | Test report | PMP15036 Test Results | Sep. 25, 2017 |
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