Capacitive Frost or Ice Detection Reference Design, Resolution of <1mm, Temperature Drift <0.25%

(ACTIVE) TIDA-01465

Description & Features

Technical Documents

Support & Training

Order Now


View the Important Notice for TI Designs covering authorized use, intellectual property matters and disclaimers.

Key Document

Description

Frost and ice buildup on cooling bodies and evaporators can significantly decrease system energy efficiency in many appliance applications such as refrigerators, air conditioners, and freezers. This sensor reference design helps to achieve the more stringent energy efficiency requirements of modern appliances through reducing the number of unnecessary defrost cycles by sensing the amount of ice buildup (resolution of < 1mm) on enclosures and metal surfaces of cooling bodies to trigger defrost cycles only when necessary, versus the traditional defrost trigger method of using a timer or temperature sensor.

Features
  • Resolution of < 1mm, temperature drift < 0.25%
  • Reduce energy by minimizing defrost cycle of melting ice or frost on evaporator coils to eliminate unnecessary defrost cycles
  • Fit for universal application in all types of refrigeration equipment with great sensitivity, high reliability, and low cost
  • Accurately sense thickness of ice or frost accumulated on surface of evaporating coils of refrigeration equipment

View the Important Notice for TI Designs covering authorized use, intellectual property matters and disclaimers.


  



Schematic/Block Diagram

Quickly understand overall system functionality.

Download Schematic

Design Guide

Get results faster with test and simulation data that's been verified.

Download Design Guide

Design Files

Download ready-to-use system files to speed your design process. Get Viewer.

Download Design Files


Bill of Materials (BOM)

Find the complete list of components in this reference design.

Download BOM

TI Devices (4)

Order samples, get tools and find more information on the TI products in this reference design.

Part Number Name Product Family Sample & Buy Design Kits & Evaluation Modules
FDC2214  Noise-immune Capacitive Sensing Solution for Proximity Sensing   Specialty sensors  Sample & Buy View Design Kits & Evaluation Modules
LP2985-N  Micropower 150mA Low-Noise Ultra-Low-Dropout Regulator  Power management  Sample & Buy View Design Kits & Evaluation Modules
MSP430F5528  25 MHz MCU with Integrated USB Phy, 128KB Flash, 8KB RAM, 12Bit/10 Channel ADC, 32BIT HW Multiplier  MSP430 ultra-low-power MCUs  Sample & Buy View Design Kits & Evaluation Modules
TPD2E001  Low-Capacitance 2-Channel +/-15kV ESD Protection Array for High-Speed Data Interfaces  Circuit protection  Sample & Buy View Design Kits & Evaluation Modules

CAD/CAE symbols

Part # Package | Pins CAD File (.bxl) STEP Model (.stp)
FDC2214 Download Download
LP2985-N Download Download
MSP430F5528 Download Download
Download -
Download -
TPD2E001 Download -
Download Download
Download -
Download Download

Texas Instruments and Accelerated Designs, Inc. have collaborated together to provide TI customers with schematic symbols and PCB layout footprints for TI products.

Step 1: Download and install the free download.

Step 2: Download the Symbol and Footprint from the CAD.bxl file table.


Technical Documents

View the Important Notice for TI Designs covering authorized use, intellectual property matters and disclaimers.

User guides (1)
Title Abstract Type Size (KB) Date Views TI Recommends
PDF 10999 09 Aug 2017 0
Design files (6)
Title Abstract Type Size (KB) Date Views
ZIP 205 05 Sep 2017 0
ZIP 1008 05 Sep 2017 0
PDF 672 05 Sep 2017 0
PDF 184 05 Sep 2017 0
PDF 33 05 Sep 2017 0
PDF 253 05 Sep 2017 0
Related Tools & Software

Reference Designs  ( 2 )

Design Kits & Evaluation Modules  ( 1 )

Name Part Number Tool Type
FDC2214 with Two Capacitive Sensors Evaluation Module  FDC2214EVM  Evaluation Modules & Boards 

Support & Training

Try our support forums.
Search expert answers for this part Ask a new question

Content is provided 'AS IS' by the respective TI and Community contributors and does not constitute TI specifications.
See terms of use.

Blogs