SNAS466G February   2009  – December 2016 ADC10D1000QML-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Converter Electrical Characteristics: Static Converter Characteristics
    6. 6.6  Converter Electrical Characteristics: Dynamic Converter Characteristics
    7. 6.7  Converter Electrical Characteristics: Analog Input/Output and Reference Characteristics
    8. 6.8  Converter Electrical Characteristics: Channel-to-Channel Characteristics
    9. 6.9  Converter Electrical Characteristics: LVDS CLK Input Characteristics
    10. 6.10 Electrical Characteristics: AutoSync Feature
    11. 6.11 Converter Electrical Characteristics: Digital Control and Output Pin Characteristics
    12. 6.12 Converter Electrical Characteristics: Power Supply Characteristics (1:2 Demux Mode)
    13. 6.13 Converter Electrical Characteristics: AC Electrical Characteristics
    14. 6.14 Timing Requirements: Serial Port Interface
    15. 6.15 Timing Requirements: Calibration
    16. 6.16 Quality Conformance Inspection
    17. 6.17 Timing Diagrams
    18. 6.18 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Features
        1. 7.3.1.1 Input Control and Adjust
          1. 7.3.1.1.1 AC- and DC-Coupled Modes
          2. 7.3.1.1.2 Input Full-Scale Range Adjust
          3. 7.3.1.1.3 Input Offset Adjust
          4. 7.3.1.1.4 DES/Non-DES Mode
          5. 7.3.1.1.5 Sampling Clock Phase Adjust
          6. 7.3.1.1.6 LC Filter-On Input Clock
          7. 7.3.1.1.7 VCMO Adjust
        2. 7.3.1.2 Output Control and Adjust
          1. 7.3.1.2.1 DDR Clock Phase
          2. 7.3.1.2.2 LVDS Output Differential Voltage
          3. 7.3.1.2.3 LVDS Output Common-Mode Voltage
          4. 7.3.1.2.4 Output Formatting
          5. 7.3.1.2.5 Demux/Non-Demux Mode
          6. 7.3.1.2.6 Test Pattern Mode
        3. 7.3.1.3 Calibration Feature
          1. 7.3.1.3.1 Calibration Pins
          2. 7.3.1.3.2 How to Initiate a Calibration Event
          3. 7.3.1.3.3 On-Command Calibration
          4. 7.3.1.3.4 Calibration Adjust
          5. 7.3.1.3.5 Calibration and Power Down
          6. 7.3.1.3.6 Read/Write Calibration Settings
        4. 7.3.1.4 Power Down
      2. 7.3.2 Power-On Reset
    4. 7.4 Device Functional Modes
      1. 7.4.1 Control Modes
        1. 7.4.1.1 Non-Extended Control Mode
          1. 7.4.1.1.1 Non-Demultiplexed Mode Pin (NDM)
          2. 7.4.1.1.2 Dual Data-Rate Phase Pin (DDRPh)
          3. 7.4.1.1.3 Calibration Pin (CAL)
          4. 7.4.1.1.4 Power-Down I-Channel Pin (PDI)
          5. 7.4.1.1.5 Power-Down Q-Channel Pin (PDQ)
          6. 7.4.1.1.6 Test Pattern Mode Pin (TPM)
          7. 7.4.1.1.7 Full-Scale Input Range Pin (FSR)
          8. 7.4.1.1.8 AC-DC-Coupled Mode Pin (VCMO)
          9. 7.4.1.1.9 LVDS Output Common-Mode Pin (VBG)
      2. 7.4.2 Extended Control Mode
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 Register Definitions
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Analog Inputs
        1. 8.1.1.1 Acquiring the Input
        2. 8.1.1.2 Terminating Unused Analog Inputs
        3. 8.1.1.3 Reference Voltage and FSR
        4. 8.1.1.4 Out-of-Range Indication
        5. 8.1.1.5 AC-Coupled Input Signals
        6. 8.1.1.6 DC-Coupled Input Signals
        7. 8.1.1.7 Single-Ended Input Signals
      2. 8.1.2 Clock Inputs
        1. 8.1.2.1 CLK Coupling
        2. 8.1.2.2 CLK Frequency
        3. 8.1.2.3 CLK Level
        4. 8.1.2.4 CLK Duty Cycle
        5. 8.1.2.5 CLK Jitter
        6. 8.1.2.6 CLK Layout
      3. 8.1.3 The LVDS Outputs
        1. 8.1.3.1 Common-Mode and Differential Voltage
        2. 8.1.3.2 Output Data Rate
      4. 8.1.4 Synchronizing Multiple ADC10D1000S in a System
        1. 8.1.4.1 AutoSync Feature
        2. 8.1.4.2 DCLK Reset Feature
  9. 9 Power Supply Recommendations
    1. 9.1 Power Planes
      1. 9.1.1 Bypass Capacitors
        1. 9.1.1.1 Ground Plane
        2. 9.1.1.2 Power Supply Example
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Board Mounting Recommendation
    2. 10.2 Layout Example
    3. 10.3 Thermal Management
    4. 10.4 Temperature Sensor Diode
    5. 10.5 Radiation Environments
      1. 10.5.1 Total Ionizing Dose
      2. 10.5.2 Single Event Latch-Up and Functional Interrupt
      3. 10.5.3 Single Event Upset
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Specification Definitions
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Engineering Samples

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NAA|376
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

12.1 Engineering Samples

Engineering samples are available for order and are identified by the MPR in the orderable device name (see Packaging Information in the POA). Engineering (MPR) samples meet the performance specifications of the datasheet at room temperature only and have not received the full space production flow or testing. Engineering samples may be QCI rejects that failed tests that would not impact the performance at room temperature, such as radiation or reliability testing.