SNAS411P August   2008  – April 2017 ADC128S102QML-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: ADC128S102QML-SP Converter
    6. 6.6 Electrical Characteristics: Radiation
    7. 6.7 Electrical Characteristics: Burn in Delta Parameters - TA at 25°C
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 ADC128S102 Transfer Function
      2. 7.3.2 Analog Inputs
      3. 7.3.3 Digital Inputs and Outputs
      4. 7.3.4 Radiation Environments
        1. 7.3.4.1 Total Ionizing Dose
        2. 7.3.4.2 Single Event Latch-Up and Functional Interrupt
        3. 7.3.4.3 Single Event Upset
    4. 7.4 Device Functional Modes
      1. 7.4.1 ADC128S102 Operation
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
    1. 9.1 Power Supply Sequence
    2. 9.2 Power Management
    3. 9.3 Power Supply Noise Considerations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
      2. 11.1.2 Device Nomenclature
        1. 11.1.2.1 Specification Definitions
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Engineering Samples

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NAC|16
  • Y|0
  • NAD|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from O Revision (November 2016) to P Revision

  • Changed feature link from 5962R07727 to 5962R07227Go

Changes from N Revision (September 2015) to O Revision

  • Changed the title of the ADC128S102QML-SP data sheetGo
  • Added Radiation Report link to FeaturesGo
  • Changed ApplicationsGo
  • Changed Device Information table Go
  • Added 14-pin CFP package option to the data sheet Go
  • Added TYPE column to the Pin Functions table Go
  • Added tablenote for digital supply voltage maximums allowed in the Absolute Maximum Ratings tableGo
  • Updated maximum tablenote for the digital supply voltage in the Absolute Maximum Ratings tableGo
  • Added tablenote for the voltage on any pin to GND maximums allowed in the Absolute Maximum Ratings tableGo
  • Added links to the Quality Conformance Inspection table to the Electrical Characteristics tablesGo
  • Added MIN and MAX test conditions for the SCLK duty cycle in the Electrical Characteristics: ADC128S102QML-SP Converter tableGo
  • Changed ADC128S102 Operational Timing Diagram imageGo
  • Changed first sentence and added MIL-STD-883G, Test Method 1019.7 link to the Total Ionizing Dose sectionGo
  • Changed total ionizing dose rate from 0.16 to 0.027 rad(Si)/sGo
  • Changed Single Event Latch-Up section to Single Event Latch-Up and Functional InterruptGo
  • Added sentence to Serial Interface section: Note that CS is asynchronous.Go
  • Added Engineering Samples sectionGo

Changes from H Revision (October 2009) to N Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from G Revision (October 2009) to H Revision

  • Added reference to Note 11. Go
  • Added Note:11.Go
  • Deleted 'TYPICAL' numbers from tDHID, tDS and tDIHGo
  • Changed Min limit on tDHID from 11 to 7. Go

Changes from F Revision (June 2009) to G Revision

  • Deleted reference to Ta Min and Ta Max under titled sections. Go

Changes from E Revision (April 2009) to F Revision

  • Changed AC Electrical Characteristics - SCLK Duty Cycle, typ limits Go

Changes from D Revision (January 2009) to E Revision

  • Changed Note 10Go
  • Changed spec typo for Clock Frequency rangeGo
  • Changed electrical headings from '8 Mhz to 16 Mhz' to '0.8 Mhz and 16 Mhz'.Go
  • Reformatted Burn In Delta tableGo
  • Added new ENOB vs SCLK Plot Go

Changes from C Revision (November 2008) to D Revision

  • Moved Rad information from Key Specifications to FeaturesGo
  • Deleted ADC128S102WGMLS referenceGo
  • Added Burn In Delta TableGo

Changes from B Revision (August 2008) to C Revision

  • Corrected package reference from 16-lead TSSOP to 16-lead Ceramic SOIC, Removed QV NSID reference and Added SMD Number to RQV NSID in Features. Go

Changes from A Revision (August 2008) to B Revision

  • Typo, Changed Figure 2, tDIS lower left hand side changed to tDS and tDIH lower left hand side change to tDH in Timing Diagrams. Go