SBAS444D May   2009  – January 2018 ADS1113 , ADS1114 , ADS1115

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagrams
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagrams
    3. 9.3 Feature Description
      1. 9.3.1 Multiplexer
      2. 9.3.2 Analog Inputs
      3. 9.3.3 Full-Scale Range (FSR) and LSB Size
      4. 9.3.4 Voltage Reference
      5. 9.3.5 Oscillator
      6. 9.3.6 Output Data Rate and Conversion Time
      7. 9.3.7 Digital Comparator (ADS1114 and ADS1115 Only)
      8. 9.3.8 Conversion Ready Pin (ADS1114 and ADS1115 Only)
      9. 9.3.9 SMbus Alert Response
    4. 9.4 Device Functional Modes
      1. 9.4.1 Reset and Power-Up
      2. 9.4.2 Operating Modes
        1. 9.4.2.1 Single-Shot Mode
        2. 9.4.2.2 Continuous-Conversion Mode
      3. 9.4.3 Duty Cycling For Low Power
    5. 9.5 Programming
      1. 9.5.1 I2C Interface
        1. 9.5.1.1 I2C Address Selection
        2. 9.5.1.2 I2C General Call
        3. 9.5.1.3 I2C Speed Modes
      2. 9.5.2 Slave Mode Operations
        1. 9.5.2.1 Receive Mode
        2. 9.5.2.2 Transmit Mode
      3. 9.5.3 Writing To and Reading From the Registers
      4. 9.5.4 Data Format
    6. 9.6 Register Map
      1. 9.6.1 Address Pointer Register (address = N/A) [reset = N/A]
        1. Table 6. Address Pointer Register Field Descriptions
      2. 9.6.2 Conversion Register (P[1:0] = 0h) [reset = 0000h]
        1. Table 7. Conversion Register Field Descriptions
      3. 9.6.3 Config Register (P[1:0] = 1h) [reset = 8583h]
        1. Table 8. Config Register Field Descriptions
      4. 9.6.4 Lo_thresh (P[1:0] = 2h) [reset = 8000h] and Hi_thresh (P[1:0] = 3h) [reset = 7FFFh] Registers
        1. Table 9. Lo_thresh and Hi_thresh Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Basic Connections
      2. 10.1.2 Single-Ended Inputs
      3. 10.1.3 Input Protection
      4. 10.1.4 Unused Inputs and Outputs
      5. 10.1.5 Analog Input Filtering
      6. 10.1.6 Connecting Multiple Devices
      7. 10.1.7 Quickstart Guide
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Shunt Resistor Considerations
        2. 10.2.2.2 Operational Amplifier Considerations
        3. 10.2.2.3 ADC Input Common-Mode Considerations
        4. 10.2.2.4 Resistor (R1, R2, R3, R4) Considerations
        5. 10.2.2.5 Noise and Input Impedance Considerations
        6. 10.2.2.6 First-order RC Filter Considerations
        7. 10.2.2.7 Circuit Implementation
        8. 10.2.2.8 Results Summary
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.2 Power-Supply Decoupling

Good power-supply decoupling is important to achieve optimum performance. VDD must be decoupled with at least a 0.1-µF capacitor, as shown in Figure 47. The 0.1-μF bypass capacitor supplies the momentary bursts of extra current required from the supply when the device is converting. Place the bypass capacitor as close to the power-supply pin of the device as possible using low-impedance connections. Use multilayer ceramic chip capacitors (MLCCs) that offer low equivalent series resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive systems, or for systems in harsh noise environments, avoid the use of vias for connecting the capacitors to the device pins for better noise immunity. The use of multiple vias in parallel lowers the overall inductance, and is beneficial for connections to ground planes.

ADS1113 ADS1114 ADS1115 ai_1end_inputs_bas444.gifFigure 47. ADS1115 Power-Supply Decoupling