SBAS501C May   2013  – August 2016 ADS1220

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 SPI Timing Requirements
    7. 6.7 SPI Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Multiplexer
      2. 8.3.2  Low-Noise PGA
        1. 8.3.2.1 PGA Common-Mode Voltage Requirements
        2. 8.3.2.2 Bypassing the PGA
      3. 8.3.3  Modulator
      4. 8.3.4  Digital Filter
      5. 8.3.5  Output Data Rate
      6. 8.3.6  Voltage Reference
      7. 8.3.7  Clock Source
      8. 8.3.8  Excitation Current Sources
      9. 8.3.9  Low-Side Power Switch
      10. 8.3.10 Sensor Detection
      11. 8.3.11 System Monitor
      12. 8.3.12 Offset Calibration
      13. 8.3.13 Temperature Sensor
        1. 8.3.13.1 Converting from Temperature to Digital Codes
          1. 8.3.13.1.1 For Positive Temperatures (for Example, 50°C):
          2. 8.3.13.1.2 For Negative Temperatures (for Example, -25°C):
        2. 8.3.13.2 Converting from Digital Codes to Temperature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
      2. 8.4.2 Conversion Modes
        1. 8.4.2.1 Single-Shot Mode
        2. 8.4.2.2 Continuous Conversion Mode
      3. 8.4.3 Operating Modes
        1. 8.4.3.1 Normal Mode
        2. 8.4.3.2 Duty-Cycle Mode
        3. 8.4.3.3 Turbo Mode
        4. 8.4.3.4 Power-Down Mode
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Ready (DRDY)
        4. 8.5.1.4 Data Input (DIN)
        5. 8.5.1.5 Data Output and Data Ready (DOUT/DRDY)
        6. 8.5.1.6 SPI Timeout
      2. 8.5.2 Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 RESET (0000 011x)
        2. 8.5.3.2 START/SYNC (0000 100x)
        3. 8.5.3.3 POWERDOWN (0000 001x)
        4. 8.5.3.4 RDATA (0001 xxxx)
        5. 8.5.3.5 RREG (0010 rrnn)
        6. 8.5.3.6 WREG (0100 rrnn)
      4. 8.5.4 Reading Data
      5. 8.5.5 Sending Commands
      6. 8.5.6 Interfacing with Multiple Devices
    6. 8.6 Register Map
      1. 8.6.1 Configuration Registers
        1. 8.6.1.1 Configuration Register 0 (offset = 00h) [reset = 00h]
        2. 8.6.1.2 Configuration Register 1 (offset = 01h) [reset = 00h]
        3. 8.6.1.3 Configuration Register 2 (offset = 02h) [reset = 00h]
        4. 8.6.1.4 Configuration Register 3 (offset = 03h) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 Analog Input Filtering
      3. 9.1.3 External Reference and Ratiometric Measurements
      4. 9.1.4 Establishing a Proper Common-Mode Input Voltage
      5. 9.1.5 Unused Inputs and Outputs
      6. 9.1.6 Pseudo Code Example
    2. 9.2 Typical Applications
      1. 9.2.1 K-Type Thermocouple Measurement (-200°C to +1250°C)
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 3-Wire RTD Measurement (-200°C to +850°C)
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
          1. 9.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Resistive Bridge Measurement
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
    2. 10.2 Power-Supply Ramp Rate
    3. 10.3 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (February 2015) to C Revision

  • Changed K-Type Thermocouple Measurement figureGo
  • Added footnote 1 to Pin Functions table and changed descriptions of AIN0/REFP1, AIN1, AIN2, AIN3/REFN1, REFN0, and REFP0 pins accordinglyGo
  • Changed Functional Block Diagram figureGo
  • Changed Bypassing the PGA sectionGo
  • Added fourth sentence to Temperature Sensor sectionGo
  • Changed last equation in Converting from Digital Codes to Temperature sectionGo
  • Changed description of bits 5:4 in Configuration Register 2Go
  • Added Unused Inputs and Outputs section Go
  • Changed Figure 74Go
  • Changed Figure 77Go
  • Changed Figure 78Go
  • Changed Figure 79Go
  • Changed Figure 82Go
  • Changed Power Supply Recommendations section: changed Power-Supply Sequencing subsection, added Power-Supply Ramp Rate subsectionGo

Changes from A Revision (July 2013) to B Revision

  • Added TI Design, Device Information, ESD Ratings, Recommended Operating Conditions, and Switching Characteristics tables and Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
  • Changed document title, QFN to VQFN throughout document, Features, Applications, Description, Pin Configuration and Functions, Parameter Measurement Information, Feature Description, Device Functional Modes, Programming, and Register Map sections, and front-page figureGo
  • Deleted Product Family table Go
  • Changed format of Absolute Maximum Ratings table, added minimum junction temperature specification, changed input current parameter name, and removed momentary input current specificationGo
  • Changed Analog Inputs and Voltage Reference Inputs sections (specification values were not changed) and added Internal Oscillator section to Electrical Characteristics tableGo
  • Changed System Performance section: changed VIO parameter name and added PGA disabled row to Offset drift, Gain error, and Gain drift parameters in System Performance section of Electrical Characteristics tableGo
  • Changed Internal Voltage Reference section: changed Reference drift parameter maximum specification and added Long-term drift parameter in Electrical Characteristics tableGo
  • Deleted Clock Sources section and changed Temperature Sensor and Power Supply sections (specification values were not changed) in Electrical Characteristics tableGo
  • Changed Digital Inputs/Outputs section, VIL parameter minimum specification in Electrical Characteristics tableGo
  • Changed SPI Timing Requirements and Figure 1 (specification values were not changed), added SPI Switching Characteristics and Figure 2 Go
  • Changed format of Typical Characteristics section (actual curves did not change)Go

Changes from * Revision (May 2013) to A Revision

  • Changed document status to Mixed Status; pre-RTM changes made throughoutGo