SBAS561C June   2012  – January 2017 ADS131E04 , ADS131E06 , ADS131E08

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Measurements
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Electromagnetic Interference (EMI) Filter
      2. 9.3.2  Input Multiplexer
        1. 9.3.2.1 Device Noise Measurements
        2. 9.3.2.2 Test Signals (TestP and TestN)
        3. 9.3.2.3 Temperature Sensor (TempP, TempN)
        4. 9.3.2.4 Power-Supply Measurements (MVDDP, MVDDN)
      3. 9.3.3  Analog Input
      4. 9.3.4  PGA Settings and Input Range
        1. 9.3.4.1 Input Common-Mode Range
      5. 9.3.5  ΔΣ Modulator
      6. 9.3.6  Clock
      7. 9.3.7  Digital Decimation Filter
      8. 9.3.8  Voltage Reference
      9. 9.3.9  Input Out-of-Range Detection
      10. 9.3.10 General-Purpose Digital I/O (GPIO)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Start
        1. 9.4.1.1 Settling Time
        2. 9.4.1.2 Input Signal Step
      2. 9.4.2 Reset (RESET)
      3. 9.4.3 Power-Down (PWDN)
      4. 9.4.4 Continuous Conversion Mode
      5. 9.4.5 Data Retrieval
        1. 9.4.5.1 Data Ready (DRDY)
        2. 9.4.5.2 Reading Back Data
        3. 9.4.5.3 Status Word
        4. 9.4.5.4 Readback Length
    5. 9.5 Programming
      1. 9.5.1 Data Format
      2. 9.5.2 SPI Interface
        1. 9.5.2.1 Chip Select (CS)
        2. 9.5.2.2 Serial Clock (SCLK)
        3. 9.5.2.3 Data Input (DIN)
        4. 9.5.2.4 Data Output (DOUT)
      3. 9.5.3 SPI Command Definitions
        1. 9.5.3.1  Sending Multibyte Commands
        2. 9.5.3.2  WAKEUP: Exit STANDBY Mode
        3. 9.5.3.3  STANDBY: Enter STANDBY Mode
        4. 9.5.3.4  RESET: Reset Registers to Default Values
        5. 9.5.3.5  START: Start Conversions
        6. 9.5.3.6  STOP: Stop Conversions
        7. 9.5.3.7  OFFSETCAL: Channel Offset Calibration
        8. 9.5.3.8  RDATAC: Start Read Data Continuous Mode
        9. 9.5.3.9  SDATAC: Stop Read Data Continuous Mode
        10. 9.5.3.10 RDATA: Read Data
        11. 9.5.3.11 RREG: Read from Register
        12. 9.5.3.12 WREG: Write to Register
    6. 9.6 Register Map
      1. 9.6.1 Register Descriptions
        1. 9.6.1.1 ID: ID Control Register (Factory-Programmed, Read-Only) (address = 00h) [reset = xxh]
        2. 9.6.1.2 CONFIG1: Configuration Register 1 (address = 01h) [reset = 91h]
        3. 9.6.1.3 CONFIG2: Configuration Register 2 (address = 02h) [reset = E0h]
        4. 9.6.1.4 CONFIG3: Configuration Register 3 (address = 03h) [reset = 40]
        5. 9.6.1.5 FAULT: Fault Detect Control Register (address = 04h) [reset = 00h]
        6. 9.6.1.6 CHnSET: Individual Channel Settings (address = 05h to 0Ch) [reset = 10h]
        7. 9.6.1.7 FAULT_STATP: Fault Detect Positive Input Status (address = 12h) [reset = 00h]
        8. 9.6.1.8 FAULT_STATN: Fault Detect Negative Input Status (address = 13h) [reset = 00h]
        9. 9.6.1.9 GPIO: General-Purpose IO Register (address = 14h) [reset = 0Fh]
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Unused Inputs and Outputs
      2. 10.1.2 Setting the Device Up for Basic Data Capture
      3. 10.1.3 Multiple Device Configuration
        1. 10.1.3.1 Synchronizing Multiple Devices
        2. 10.1.3.2 Standard Configuration
        3. 10.1.3.3 Daisy-Chain Configuration
      4. 10.1.4 Power Monitoring Specific Applications
      5. 10.1.5 Current Sensing
      6. 10.1.6 Voltage Sensing
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
  11. 11Power Supply Recommendations
    1. 11.1 Power-Up Timing
    2. 11.2 Recommended External Capacitor Values
    3. 11.3 Device Connections for Unipolar Power Supplies
    4. 11.4 Device Connections for Bipolar Power Supplies
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Third-Party Products Disclaimer
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resource
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

13 Device and Documentation Support

13.1 Device Support

13.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

13.2 Related Links

Table 24 lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

Table 24. Related Links

PARTS PRODUCT FOLDER ORDER NOW TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY
ADS131E04 Click here Click here Click here Click here Click here
ADS131E06 Click here Click here Click here Click here Click here
ADS131E08 Click here Click here Click here Click here Click here

13.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

13.4 Community Resource

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

13.5 Trademarks

E2E is a trademark of Texas Instruments.

SPI is a trademark of Motorola.

All other trademarks are the property of their respective owners.

13.6 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

13.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.